Inventor · disambiguated record
Tae-Ho Moon
Also filed as: MOON TAE-HO
2 granted patents·2 pending applications·1 citations·filing 2007–2014
32Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0152US8698311B2Package substrate and semiconductor package including the sameKANG TAE-GYU·Filed 2012·Granted Apr 15, 2014·1 cites·18 claims
- 0247US2014191397A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0337US2008136027A1Method of bonding wire of semiconductor packageMOON TAE-HO·Filed 2007·Application pending·0 cites
- 0435US8905290B2Apparatus for mounting semiconductor chips on a circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 9, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →