Inventor · disambiguated record
Taro Moriya
Also filed as: MORIYA TARO
13 granted patents·6 pending applications·7 citations·filing 2005–2024
84Inventor score
Top patents by PatentIndex Score
19 records- 0178US9923091B2Semiconductor device including power MOS transistorRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 20, 2018·3 cites·9 claims
- 0271US9954095B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·2 cites·19 claims
- 0365US10529846B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·1 cites·8 claims
- 0460US9184285B2Semiconductor device with gate electrodes buried in trenchesRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 10, 2015·1 cites·5 claims
- 0559US2025169088A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0653US2023246025A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 0753US2023290877A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 0852US11652100B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted May 16, 2023·0 cites·19 claims
- 0950US8089165B2Device comprising electrode padMORIYA TARO·Filed 2009·Granted Jan 3, 2012·0 cites·11 claims
- 1049US8969150B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 3, 2015·0 cites·9 claims
- 1149US8765361B2Reticle and manufacturing method of solid-state image sensorMORIYA TARO·Filed 2012·Granted Jul 1, 2014·0 cites·6 claims
- 1248US9029953B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted May 12, 2015·0 cites·8 claims
- 1348US8803226B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 12, 2014·0 cites·11 claims
- 1446US7547976B2Electrode pad arrangement with open side for waste removalNEC ELECTRONICS CORP·Filed 2005·Granted Jun 16, 2009·0 cites·7 claims
- 1546US2016027916A1Semiconductor device with gate electrodes buried in trenchesRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1645US8288061B2Reticle and manufacturing method of solid-state image sensorMORIYA TARO·Filed 2010·Granted Oct 16, 2012·0 cites·11 claims
- 1745US2015228737A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1845US2006073628A1Solid-state imaging device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1942US11004749B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →