Inventor · disambiguated record
Takahide Mukoyama
Also filed as: MUKOYAMA TAKAHIDE
16 granted patents·2 pending applications·49 citations·filing 1995–2020
90Inventor score
Top patents by PatentIndex Score
18 records- 0183US9992878B2Circuit board and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jun 5, 2018·4 cites·9 claims
- 0283US9709619B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2013·Granted Jul 18, 2017·5 cites·4 claims
- 0374US10353158B2Light emitting element bonded board and method of manufacturing light emitting element bonded boardFUJITSU LTD·Filed 2017·Granted Jul 16, 2019·2 cites·5 claims
- 0474US9148958B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Sep 29, 2015·2 cites·2 claims
- 0574US8648260B2Wiring substrateOOI TAKAHIRO·Filed 2011·Granted Feb 11, 2014·4 cites·4 claims
- 0668US10212805B2Printed circuit board and electric deviceFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·1 cites·9 claims
- 0767US8958211B2Circuit board and electronic deviceHIROSHIMA YOSHIYUKI·Filed 2011·Granted Feb 17, 2015·2 cites·9 claims
- 0866US11158964B2Electronic component and substrateFUJITSU LTD·Filed 2020·Granted Oct 26, 2021·0 cites·7 claims
- 0965US9763331B2Printed circuit board, electronic device, and manufacturing methodFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·1 cites·9 claims
- 1062US10714849B2Electronic component and substrateFUJITSU LTD·Filed 2019·Granted Jul 14, 2020·1 cites·10 claims
- 1160US5825635AWarp prevention and cable holding structure for printed circuit boardFUJITSU LTD·Filed 1995·Granted Oct 20, 1998·25 cites·5 claims
- 1258US9049794B2Wiring substrate and method for manufacturing the wiring substrateMORITA YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·1 cites·6 claims
- 1355US10605851B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2017·Granted Mar 31, 2020·0 cites·1 claims
- 1451US10492291B2Wiring board manufacturing methodFUJITSU LTD·Filed 2017·Granted Nov 26, 2019·0 cites·10 claims
- 1550US8631568B2Printed wiring board manufacturing methodYAMADA TETSURO·Filed 2011·Granted Jan 21, 2014·1 cites·8 claims
- 1649US10164312B2Wiring board, electronic apparatus, and manufacturing method of wiring boardFUJITSU LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 1745US2012234587A1Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring boardNAKAMURA NAOKI·Filed 2012·Application pending·0 cites
- 1836US2012106105A1Wiring board having a plurality of viasSUGANE MITSUHIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →