Inventor · disambiguated record
Takanori Muramoto
Also filed as: MURAMOTO TAKANORI
7 granted patents·9 pending applications·156 citations·filing 1996–2011
86Inventor score
Top patents by PatentIndex Score
16 records- 0190US6297131B1Semiconductor device manufacturing method for grinding and dicing a wafer from a back side of the waferFUJITSU LTD·Filed 1999·Granted Oct 2, 2001·120 cites·7 claims
- 0281US7963308B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2006·Granted Jun 21, 2011·5 cites·23 claims
- 0379US8268113B2Apparatus and method for fabricating bonded substrateMURAMOTO TAKANORI·Filed 2011·Granted Sep 18, 2012·4 cites·4 claims
- 0476US7597774B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Oct 6, 2009·3 cites·4 claims
- 0571US7704348B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Granted Apr 27, 2010·2 cites·1 claims
- 0656US7137427B2Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2003·Granted Nov 21, 2006·3 cites·9 claims
- 0756US2008083439A1Cleaning method and cleaner device for laminated substrate fabrication apparatusFUJITSU LTD·Filed 2007·Application pending·0 cites
- 0853US2005236105A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2004·Application pending·0 cites
- 0951US2011011541A1Apparatus and method for fabricating bonded substrateFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1051US2006221538A1Cleaning method and cleaner device for laminated substrate fabrication apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1150US2010230030A1Apparatus and method for fabricating bonded substrateFUJITSU LTD KAWASAKI JAPAN·Filed 2010·Application pending·0 cites
- 1246US2007235130A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1345US5930654AMethod of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tapeFUJITSU LTD·Filed 1996·Granted Jul 27, 1999·19 cites·9 claims
- 1443US2006005920A1Method for fabricating bonded substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1536US2003226633A1Method and apparatus for fabricating bonded substrateFUJITSU LTD·Filed 2003·Application pending·0 cites
- 1635US2006157192A1Apparatus and method for manufacturing laminated substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →