Inventor · disambiguated record
Takashi Nagasaka
Also filed as: NAGASAKA TAKASHI
39 granted patents·1 pending application·1,029 citations·filing 1990–2008
98Inventor score
Files withNIPPON DENSO CO17DENSO CORP14TDK CORP6SUMITOMO METAL CERAMICS INC2SUMITOMO METAL SMI ELECTRONICS1
Top patents by PatentIndex Score
40 records- 0196US6791445B2Coil-embedded dust core and method for manufacturing the sameTDK CORP·Filed 2002·Granted Sep 14, 2004·64 cites·11 claims
- 0289US6376906B1Mounting structure of semiconductor elementDENSO CORP·Filed 1998·Granted Apr 23, 2002·122 cites·42 claims
- 0384US5657203AElectronic device having a plurality of circuit boards arranged thereinNIPPON DENSO CO·Filed 1995·Granted Aug 12, 1997·92 cites·12 claims
- 0483US5408383AContainer for electronic devices having a plurality of circuit boardsNIPPON DENSO CO·Filed 1993·Granted Apr 18, 1995·81 cites·26 claims
- 0582US6940387B2Coil-embedded dust core and method for manufacturing the sameTDK CORP·Filed 2004·Granted Sep 6, 2005·16 cites·6 claims
- 0679US6079610AWire bonding methodDENSO CORP·Filed 1997·Granted Jun 27, 2000·60 cites·13 claims
- 0776US5586388AMethod for producing multi-board electronic deviceNIPPON DENSO CO·Filed 1995·Granted Dec 24, 1996·59 cites·13 claims
- 0875US5731067AMulti-layered substrateDENSO CORP·Filed 1996·Granted Mar 24, 1998·49 cites·26 claims
- 0975US5646827AElectronic device having a plurality of circuit boards arranged thereinNIPPON DENSO CO·Filed 1995·Granted Jul 8, 1997·53 cites·6 claims
- 1073US6458670B2Method of manufacturing a circuit substrateDENSO CORP·Filed 2001·Granted Oct 1, 2002·15 cites·28 claims
- 1171US5156903AMultilayer ceramic substrate and manufacture thereofSUMITOMO METAL CERAMICS INC·Filed 1990·Granted Oct 20, 1992·38 cites·8 claims
- 1266US6174462B1Conductive paste composition including conductive metallic powderDENSO CORP·Filed 1999·Granted Jan 16, 2001·36 cites·23 claims
- 1365US6888259B2Potted hybrid integrated circuitDENSO CORP·Filed 2002·Granted May 3, 2005·12 cites·14 claims
- 1463US5919317ASoldering flux, soldering paste and soldering method using the sameNIPPON DENSO CO·Filed 1995·Granted Jul 6, 1999·27 cites·14 claims
- 1563US5562973ACeramic multi-layer wiring boardNIPPON DENSO CO·Filed 1995·Granted Oct 8, 1996·27 cites·7 claims
- 1661US6601752B2Electronic part mounting methodDENSO CORP·Filed 2001·Granted Aug 5, 2003·10 cites·20 claims
- 1761US6201286B1Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the sameDENSO CORP·Filed 1998·Granted Mar 13, 2001·18 cites·47 claims
- 1861US5627344AMultilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrateSUMITOMO METAL CERAMICS INC·Filed 1994·Granted May 6, 1997·26 cites·6 claims
- 1961US5383093AHybrid integrated circuit apparatusNIPPON DENSO CO·Filed 1993·Granted Jan 17, 1995·26 cites·15 claims
- 2058US7551053B2Coil deviceTDK CORP·Filed 2004·Granted Jun 23, 2009·6 cites·23 claims
- 2158US5593722AMethod of producing thick multi-layer substratesNIPPON DENSO CO·Filed 1996·Granted Jan 14, 1997·19 cites·22 claims
- 2258US5439732ACeramic multi-layer wiring boardNIPPON DENSO CO·Filed 1994·Granted Aug 8, 1995·26 cites·12 claims
- 2352US6020048AThick film circuit board and method of forming wire bonding electrode thereonDENSO CORP·Filed 1997·Granted Feb 1, 2000·17 cites·29 claims
- 2450US6645606B2Electrical device having metal pad bonded with metal wiring and manufacturing method thereofDENSO CORP·Filed 2002·Granted Nov 11, 2003·4 cites·8 claims
- 2550US6217990B1Multilayer circuit board having no local warp on mounting surface thereofDENSO CORP·Filed 1998·Granted Apr 17, 2001·19 cites·13 claims
- 2650US5500278AMultilayer substrateNIPPON DENSO CO·Filed 1994·Granted Mar 19, 1996·17 cites·31 claims
- 2748USD605662SCoil unitTDK CORP·Filed 2008·Granted Dec 8, 2009·6 cites·1 claims
- 2848US6731001B2Semiconductor device including bonded wire based to electronic part and method for manufacturing the sameDENSO CORP·Filed 2001·Granted May 4, 2004·3 cites·31 claims
- 2947US6326239B1Mounting structure of electronic parts and mounting method of electronic partsDENSO CORP·Filed 1999·Granted Dec 4, 2001·14 cites·12 claims
- 3046US7746207B2Coil deviceTDK CORP·Filed 2004·Granted Jun 29, 2010·2 cites·17 claims
- 3145US5729893AProcess for producing a multilayer ceramic circuit substrateSUMITOMO METAL SMI ELECTRONICS·Filed 1995·Granted Mar 24, 1998·12 cites·3 claims
- 3244US6142363ASoldering method using soldering flux and soldering pasteNIPPON DENSO CO·Filed 1999·Granted Nov 7, 2000·11 cites·25 claims
- 3343US5290375AProcess for manufacturing ceramic multilayer substrateNIPPON DENSO CO·Filed 1993·Granted Mar 1, 1994·16 cites·11 claims
- 3442US2004174239A1Coil-embedded dust core and method for manufacturing the sameTDK CORP·Filed 2004·Application pending·0 cites
- 3538US5483217AElectronic circuit deviceNIPPON DENSO CO·Filed 1993·Granted Jan 9, 1996·8 cites·9 claims
- 3637US5506494AResistor circuit with reduced temperature coefficient of resistanceNIPPON DENSO CO·Filed 1993·Granted Apr 9, 1996·4 cites·29 claims
- 3736US5897724AMethod of producing a hybrid integrated circuitNIPPON DENSO CO·Filed 1997·Granted Apr 27, 1999·5 cites·14 claims
- 3831US5754093AThick-film printed substrate including an electrically connecting member and method for fabricating the sameNIPPON DENSO CO·Filed 1996·Granted May 19, 1998·1 cites·20 claims
- 3930US6048424AMethod for manufacturing ceramic laminated substrateDENSO CORP·Filed 1998·Granted Apr 11, 2000·4 cites·10 claims
- 4028US5308686ASubstrate having a multiple metal protected conductive layer and method of manufacturing the sameNIPPON DENSO CO·Filed 1991·Granted May 3, 1994·4 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →