Inventor · disambiguated record
Takuyo Nakamura
Also filed as: NAKAMURA TAKUYO
6 granted patents·3 pending applications·4 citations·filing 2011–2025
70Inventor score
Technology areasH10P
Top patents by PatentIndex Score
9 records- 0170US8932944B2Silicon carbide semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jan 13, 2015·2 cites·9 claims
- 0269US8525189B2Silicon carbide semiconductor deviceTARUI YOICHIRO·Filed 2011·Granted Sep 3, 2013·2 cites·7 claims
- 0354US2024353351A1Semiconductor inspection apparatus, method of inspecting semiconductor wafer, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0453US11948794B2Method of manufacturing silicon carbide epitaxial waferMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Apr 2, 2024·0 cites·8 claims
- 0548US2025372436A1Semiconductor manufacturing apparatus and method for manufacturing semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0645US10886184B2Test condition determining apparatus and test condition determining methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 5, 2021·0 cites·8 claims
- 0744US10229830B2Method of manufacturing silicon carbide epitaxial waferMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Mar 12, 2019·0 cites·6 claims
- 0842US9530703B2Method for manufacturing silicon carbide semiconductor deviceSUGIMOTO HIROSHI·Filed 2012·Granted Dec 27, 2016·0 cites·7 claims
- 0942US2020321437A1Silicon carbide epitaxial wafer, method for manufacturing silicon carbide epitaxial wafer, and power converterMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →