Inventor · disambiguated record
Taibo Nakazawa
Also filed as: NAKAZAWA TAIBO
2 granted patents·4 pending applications·23 citations·filing 2000–2008
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0171US6429043B1Semiconductor circuitry device and method for manufacturing the sameNEC CORP·Filed 2000·Granted Aug 6, 2002·23 cites·5 claims
- 0236US6972488B2Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resinNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Dec 6, 2005·0 cites·8 claims
- 0336US2008296750A1Semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 0435US2003030154A1Resin-sealed type semiconductor deviceNEC COMPOUND SEMICONDUCTOR·Filed 2002·Application pending·0 cites
- 0532US2003197250A1Semiconductor device and method of fabricating the sameNEC COMPOUND SEMICONDUCTOR·Filed 2003·Application pending·0 cites
- 0631US2005275090A1Chip-component-mounted device and semiconductor deviceNEC COMPOUND SEMICONDUCTOR·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →