Inventor · disambiguated record
Takahito Nakazawa
Also filed as: NAKAZAWA TAKAHITO
9 granted patents·1 pending application·526 citations·filing 1995–2010
91Inventor score
Top patents by PatentIndex Score
10 records- 0197US6448665B1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 1998·Granted Sep 10, 2002·211 cites·15 claims
- 0289US5998243AMethod for manufacturing semiconductor device and apparatus for resin-encapsulatingTOSHIBA KK·Filed 1998·Granted Dec 7, 1999·137 cites·2 claims
- 0380US6011312AFlip-chip semiconductor packageTOSHIBA KK·Filed 1997·Granted Jan 4, 2000·69 cites·5 claims
- 0478US6774011B2Chip pickup device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 10, 2004·21 cites·6 claims
- 0573US5935375AApparatus and method for manufacturing a semiconductor packageTOSHIBA KK·Filed 1997·Granted Aug 10, 1999·39 cites·12 claims
- 0666US5677246AMethod of manufacturing semiconductor devicesTOSHIBA KK·Filed 1995·Granted Oct 14, 1997·38 cites·22 claims
- 0764US8241999B2Semiconductor device having a protection pattern with two element separation regionsIKEDA TAKAFUMI·Filed 2010·Granted Aug 14, 2012·3 cites·5 claims
- 0858US6379484B2Method for manufacturing a semiconductor packageTOSHIBA KK·Filed 2000·Granted Apr 30, 2002·4 cites·5 claims
- 0945US2001020736A1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 2001·Application pending·0 cites
- 1034US6191024B1Apparatus and method for manufacturing a semiconductor packageTOSHIBA KK·Filed 1999·Granted Feb 20, 2001·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →