Inventor · disambiguated record
Takahisa Namiki
Also filed as: NAMIKI TAKAHISA
39 granted patents·4 pending applications·963 citations·filing 1990–2010
98Inventor score
Top patents by PatentIndex Score
43 records- 0196US6329125B2Chemically amplified resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 2000·Granted Dec 11, 2001·154 cites·1 claims
- 0296US6013416AChemically amplified resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 1996·Granted Jan 11, 2000·164 cites·15 claims
- 0396US5968713AChemically amplified resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 1997·Granted Oct 19, 1999·165 cites·20 claims
- 0492US6200725B1Chemically amplified resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 1997·Granted Mar 13, 2001·105 cites·8 claims
- 0588US6506534B1Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·29 cites·11 claims
- 0687US7585610B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Sep 8, 2009·9 cites·5 claims
- 0783US7202289B2Biodegradable resin composition, filler therefor and molded article thereofFUJITSU LTD·Filed 2003·Granted Apr 10, 2007·17 cites·18 claims
- 0882US8334091B2Resist pattern swelling material, and method for patterning using sameNOZAKI KOJI·Filed 2008·Granted Dec 18, 2012·7 cites·15 claims
- 0981US7338750B2Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereofFUJITSU LTD·Filed 2002·Granted Mar 4, 2008·25 cites·19 claims
- 1079US7820367B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the sameFUJITSU LTD·Filed 2005·Granted Oct 26, 2010·4 cites·8 claims
- 1175US7189783B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2002·Granted Mar 13, 2007·13 cites·20 claims
- 1274US8349542B2Manufacturing process of semiconductor deviceFUJITSU LTD·Filed 2010·Granted Jan 8, 2013·2 cites·4 claims
- 1374US7744768B2Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereofFUJITSU LTD·Filed 2006·Granted Jun 29, 2010·3 cites·7 claims
- 1474US5910392AResist composition, a process for forming a resist pattern and a process for manufacturing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jun 8, 1999·46 cites·17 claims
- 1573US7799508B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2009·Granted Sep 21, 2010·3 cites·24 claims
- 1673US6052261AMethod for manufacturing magnetoresistance headFUJITSU LTD·Filed 1996·Granted Apr 18, 2000·23 cites·28 claims
- 1770US5482174AMethod for removing copper oxide on the surface of a copper film and a method for patterning a copper filmFUJITSU LTD·Filed 1994·Granted Jan 9, 1996·30 cites·16 claims
- 1870US5240813APolysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereofFUJITSU LTD·Filed 1990·Granted Aug 31, 1993·27 cites·5 claims
- 1968US5633121AMethod for examining surface of copper layer in circuit board and process for producing circuit boardFUJITSU LTD·Filed 1996·Granted May 27, 1997·28 cites·15 claims
- 2067US6773867B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Aug 10, 2004·7 cites·39 claims
- 2166US8198014B2Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the sameKOZAWA MIWA·Filed 2007·Granted Jun 12, 2012·2 cites·13 claims
- 2264US7452657B2Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereofFUJITSU LTD·Filed 2005·Granted Nov 18, 2008·1 cites·18 claims
- 2360US6794112B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·4 cites·6 claims
- 2460US5484687APolysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereofFUJITSU LTD·Filed 1993·Granted Jan 16, 1996·10 cites·14 claims
- 2558US6200724B1Chemical amplification resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 1996·Granted Mar 13, 2001·16 cites·16 claims
- 2657US6794113B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·3 cites·20 claims
- 2756US7642650B2Semiconductor device having a pillar structureFUJITSU MICROELECTRONICS LTD·Filed 2004·Granted Jan 5, 2010·7 cites·19 claims
- 2856US7550248B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2005·Granted Jun 23, 2009·4 cites·17 claims
- 2956US5776659AIonizing radiation exposure method utilizing water soluble aniline antistatic polymer layerFUJITSU LTD·Filed 1996·Granted Jul 7, 1998·13 cites·8 claims
- 3054US6582878B2Chemical amplification resist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 2001·Granted Jun 24, 2003·3 cites·3 claims
- 3153US7361448B2Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2004·Granted Apr 22, 2008·3 cites·30 claims
- 3253US6787288B2Negative resist composition, method for the formation of resist patterns and process for the production of electronic devicesFUJITSU LTD·Filed 2002·Granted Sep 7, 2004·2 cites·22 claims
- 3352US8198009B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the sameKOZAWA MIWA·Filed 2010·Granted Jun 12, 2012·0 cites·22 claims
- 3447US5962191AResist compositions for forming resist patternsFUJITSU LTD·Filed 1998·Granted Oct 5, 1999·11 cites·7 claims
- 3542US7364829B2Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor deviceFUJITSU LTD·Filed 2003·Granted Apr 29, 2008·0 cites·24 claims
- 3642US2003175624A1Resist pattern swelling material, and method for patterning using sameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 3742US2007048660A1Resist composition, method for forming resist pattern, semiconductor device and method for manufacturing thereofFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3841US5804354AComposition for forming conductivity imparting agent and pattern forming methodFUJITSU LTD·Filed 1997·Granted Sep 8, 1998·8 cites·3 claims
- 3941US2006188805A1Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4040US5824452AResist compositions and process for the formation of resist patternsFUJITSU LTD·Filed 1996·Granted Oct 20, 1998·7 cites·7 claims
- 4138US6465137B2Resist composition and pattern forming processFUJITSU LTD·Filed 1999·Granted Oct 15, 2002·5 cites·7 claims
- 4237US2003102285A1Resist pattern thickening material, resist pattern and forming method thereof, and semiconductor device and manufacturing method thereofFiled 2002·Application pending·0 cites
- 4334US6605414B2Method for manufacturing magnetoresistance headFUJITSU LIMTIED·Filed 1999·Granted Aug 12, 2003·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →