Inventor · disambiguated record
Takashi Nauchi
Also filed as: NAUCHI TAKASHI
8 granted patents·1 pending application·92 citations·filing 1991–2021
84Inventor score
Top patents by PatentIndex Score
9 records- 0183US9511438B2Solder bump forming method and apparatusSENJU METAL INDUSTRY CO·Filed 2012·Granted Dec 6, 2016·8 cites·4 claims
- 0282US5338008ASolder reflow furnaceSENJU METAL INDUSTRY CO·Filed 1993·Granted Aug 16, 1994·44 cites·5 claims
- 0379US10932372B2Fluid discharge deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Feb 23, 2021·3 cites·10 claims
- 0472US5154338ASolder reflow furnaceSENJU METAL INDUSTRY CO·Filed 1991·Granted Oct 13, 1992·29 cites·10 claims
- 0561US11259415B2Method for discharging fluidSENJU METAL INDUSTRY CO·Filed 2021·Granted Feb 22, 2022·0 cites·3 claims
- 0657US6955285B2Apparatus for aligning and dispensing solder columns in an arraySENJU METAL INDUSTRY CO·Filed 2003·Granted Oct 18, 2005·8 cites·7 claims
- 0736US2004144834A1Apparatus and method for aligning and attaching solder columns to a substrateFiled 2004·Application pending·0 cites
- 0835US10632492B2Fluid discharge device, fluid discharge method, and fluid application deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Apr 28, 2020·0 cites·7 claims
- 0934US9283686B2Method for manufacturing solder column, apparatus for manufacturing solder column, and solder columnNOMOTO SHINICHI·Filed 2010·Granted Mar 15, 2016·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →