Inventor · disambiguated record
Takaya Noguchi
Also filed as: NOGUCHI TAKAYA
20 granted patents·4 pending applications·23 citations·filing 2008–2024
89Inventor score
Top patents by PatentIndex Score
24 records- 0190US9659795B2Foreign matter removal device and foreign matter removal methodOKADA AKIRA·Filed 2012·Granted May 23, 2017·12 cites·9 claims
- 0289US10495668B2Evaluation apparatus for semiconductor device and evaluation method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 3, 2019·6 cites·28 claims
- 0375US12345739B2Semiconductor test apparatus and semiconductor test methodMITSUBISHI ELECTRIC CORP·Filed 2024·Granted Jul 1, 2025·0 cites·7 claims
- 0471US10359448B2Device and method for inspecting position of probe, and semiconductor evaluation apparatusMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 23, 2019·1 cites·30 claims
- 0571US10209273B2Probe position inspection apparatus, semiconductor device inspection apparatus and semiconductor device inspection methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 19, 2019·1 cites·19 claims
- 0670US9257316B2Semiconductor testing jig and transfer jig for the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 9, 2016·2 cites·19 claims
- 0765US12007414B2Semiconductor test apparatus and semiconductor test methodMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 11, 2024·0 cites·7 claims
- 0864US8980655B2Test apparatus and test methodMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Mar 17, 2015·1 cites·20 claims
- 0957US2024203830A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1056US2024404892A1Method of manufacturing semiconductor device and semiconductor manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1155US11828786B2Electrical characteristic inspection device for semiconductor device and electrical characteristic inspection method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 28, 2023·0 cites·4 claims
- 1253US2010286317A1Polypropylene Resin Composition, Formed Product Composed of the Resin Composition, and Production Process of the Formed ProductKUREHA CORP·Filed 2008·Application pending·0 cites
- 1351US11901201B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Feb 13, 2024·0 cites·22 claims
- 1450US11380596B2Semiconductor test apparatus, semiconductor device test method, and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jul 5, 2022·0 cites·10 claims
- 1547US10436833B2Evaluation apparatus and evaluation methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
- 1646US9804197B2Evaluation apparatus and probe position inspection methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 31, 2017·0 cites·17 claims
- 1746US9678143B2Semiconductor evaluation apparatusMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 13, 2017·0 cites·11 claims
- 1844US9684015B2Measuring apparatus and measuring method utilizing insulating liquidMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 20, 2017·0 cites·19 claims
- 1944US9562929B2Measurement deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 7, 2017·0 cites·17 claims
- 2044US9117656B2Semiconductor cleaning device and semiconductor cleaning methodOKADA AKIRA·Filed 2012·Granted Aug 25, 2015·0 cites·22 claims
- 2142US10725086B2Evaluation apparatus of semiconductor device and method of evaluating semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 2242US10168380B2Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation methodMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 1, 2019·0 cites·20 claims
- 2338US9684027B2Measuring apparatusMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 20, 2017·0 cites·13 claims
- 2436US2016377486A1Contact-probe type temperature detector, semiconductor device evaluation apparatus and semiconductor device evaluating methodMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →