Inventor · disambiguated record
Takashi Noma
Also filed as: NOMA TAKASHI
128 granted patents·31 pending applications·2,221 citations·filing 1975–2025
99Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC44SANYO ELECTRIC CO36MURATA MANUFACTURING CO28CANON KK17TEIJIN LTD7
Top patents by PatentIndex Score
159 records- 0198US7256073B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2006·Granted Aug 14, 2007·58 cites·9 claims
- 0298US6864172B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Mar 8, 2005·319 cites·23 claims
- 0397US6632113B1Image display apparatus, disassembly processing method therefor, and component recovery methodCANON KK·Filed 2000·Granted Oct 14, 2003·100 cites·21 claims
- 0497US4018735AAnisotropic dopes of aromatic polyamidesTEIJIN LTD·Filed 1975·Granted Apr 19, 1977·121 cites·13 claims
- 0596US7662670B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Feb 16, 2010·61 cites·21 claims
- 0695US8532257B2X-ray imaging apparatus and X-ray imaging methodMUKAIDE TAIHEI·Filed 2010·Granted Sep 10, 2013·23 cites·13 claims
- 0795US7973633B2DC to DC converter moduleMURATA MANUFACTURING CO·Filed 2010·Granted Jul 5, 2011·18 cites·20 claims
- 0895US7399683B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 15, 2008·33 cites·28 claims
- 0995US7233135B2Ripple converterMURATA MANUFACTURING CO·Filed 2004·Granted Jun 19, 2007·94 cites·3 claims
- 1095US7102238B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Sep 5, 2006·49 cites·9 claims
- 1195US5622634AMethod of manufacturing electron-emitting device, electron source and image-forming apparatusCANON KK·Filed 1994·Granted Apr 22, 1997·141 cites·54 claims
- 1294US9640497B1Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 2, 2017·10 cites·15 claims
- 1393US7271466B2Semiconductor device with sidewall wiringSANYO ELECTRIC CO·Filed 2005·Granted Sep 18, 2007·25 cites·7 claims
- 1493US5645462AElectron-emitting device, and electron beam-generating apparatus and image-forming apparatus employing the deviceCANON KK·Filed 1996·Granted Jul 8, 1997·71 cites·3 claims
- 1592US7416462B2Glass substrate processing method and material removal process using x-ray fluorescenceCANON KK·Filed 2005·Granted Aug 26, 2008·13 cites·10 claims
- 1692US7101735B2Manufacturing method of semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Sep 5, 2006·57 cites·19 claims
- 1791US12469709B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 1891US8102039B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jan 24, 2012·25 cites·8 claims
- 1991US7508072B2Semiconductor device with pad electrode for testing and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Mar 24, 2009·19 cites·13 claims
- 2091US7371693B2Manufacturing method of semiconductor device with chamferingSANYO ELECTRIC CO·Filed 2004·Granted May 13, 2008·40 cites·8 claims
- 2190US7719102B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2008·Granted May 18, 2010·13 cites·23 claims
- 2290US7413931B2Semiconductor device manufacturing methodSANYO ELECTRIC CO·Filed 2005·Granted Aug 19, 2008·20 cites·6 claims
- 2390US7312521B2Semiconductor device with holding memberSANYO ELECTRIC CO·Filed 2003·Granted Dec 25, 2007·49 cites·10 claims
- 2489US8715855B2Method of producing lithium ion-storing/releasing material, lithium ion-storing/releasing material, and electrode structure and energy storage device using the materialKAWAKAMI SOICHIRO·Filed 2012·Granted May 6, 2014·8 cites·3 claims
- 2589US6184631B1Piezoelectric inverterMURATA MANUFACTURING CO·Filed 2000·Granted Feb 6, 2001·54 cites·16 claims
- 2689US4640592AOptical display utilizing thermally formed bubble in a liquid core waveguideCANON KK·Filed 1984·Granted Feb 3, 1987·58 cites·9 claims
- 2788US7919875B2Semiconductor device with recess portion over pad electrodeSANYO ELECTRIC CO·Filed 2007·Granted Apr 5, 2011·16 cites·4 claims
- 2887US10896819B2Backside metal photolithographic patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 19, 2021·3 cites·20 claims
- 2986US7782024B2Switching control circuitSANYO ELECTRIC CO·Filed 2007·Granted Aug 24, 2010·30 cites·8 claims
- 3085US10825731B2Methods of aligning a semiconductor wafer for singulationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 3, 2020·2 cites·20 claims
- 3185US10020582B2Coil antenna and communication terminal deviceMURATA MANUFACTURING CO·Filed 2015·Granted Jul 10, 2018·4 cites·18 claims
- 3285US7940507B2Switching control circuit and self-excited DC-DC converterSANYO ELECTRIC CO·Filed 2010·Granted May 10, 2011·7 cites·5 claims
- 3385US7362595B2DC-DC converterMURATA MANUFACTURING CO·Filed 2006·Granted Apr 22, 2008·14 cites·4 claims
- 3485US2025062263A1Semiconductor wafer and method of ball drop on thin wafer with edge support ringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 3584US11646267B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 9, 2023·1 cites·19 claims
- 3684US6144139APiezoelectric transformer inverterMURATA MANUFACTURING CO·Filed 1999·Granted Nov 7, 2000·60 cites·16 claims
- 3784US6055029ABacklighting system for a liquid crystal display including an integrally molded light guiding plate and frame with a deformation absorbing meansSTANLEY ELECTRIC CO LTD·Filed 1997·Granted Apr 25, 2000·87 cites·7 claims
- 3883US12199041B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 3983US8971496B2X-ray waveguideOKAMOTO KOHEI·Filed 2011·Granted Mar 3, 2015·8 cites·6 claims
- 4083US8958531B2X-ray waveguideOKAMOTO KOHEI·Filed 2011·Granted Feb 17, 2015·5 cites·7 claims
- 4183US7633133B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 15, 2009·12 cites·10 claims
- 4283US7199561B2DC-DC converter and converter deviceMURATA MANUFACTURING CO·Filed 2005·Granted Apr 3, 2007·12 cites·6 claims
- 4382US11257759B1Isolation in a semiconductor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
- 4482US11164835B2Semiconductor wafer and method of ball drop on thin wafer with edge support ringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 2, 2021·2 cites·20 claims
- 4581US7576402B2Semiconductor device, method of manufacturing the same, and camera moduleSANYO ELECTRIC CO·Filed 2006·Granted Aug 18, 2009·9 cites·4 claims
- 4681US7417413B2Ripple converterMURATA MANUFACTURING CO·Filed 2007·Granted Aug 26, 2008·14 cites·11 claims
- 4781US5530314AElectron-emitting device and electron beam-generating apparatus and image-forming apparatus employing the deviceCANON KK·Filed 1994·Granted Jun 25, 1996·31 cites·32 claims
- 4880US8611503B2X-ray waveguideOKAMOTO KOHEI·Filed 2011·Granted Dec 17, 2013·6 cites·5 claims
- 4980US8559600B2X-ray waveguideOKAMOTO KOHEI·Filed 2011·Granted Oct 15, 2013·6 cites·11 claims
- 5080US2025266280A1Substrate alignment systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
Showing the top 50 of 159 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →