Inventor · disambiguated record
Takao Ochi
Also filed as: OCHI TAKAO
20 granted patents·4 pending applications·508 citations·filing 1996–2025
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD10PANASONIC CORP5NEC CORP4HASEGAWA T CO LTD1ITO TETSUO1
Top patents by PatentIndex Score
24 records- 0197US6582991B1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 24, 2003·175 cites·5 claims
- 0290US5708293ALead frame and method of mounting semiconductor chipMATSUSHITA ELECTRONICS CORP·Filed 1996·Granted Jan 13, 1998·161 cites·16 claims
- 0389US11909647B2Encryption key generationNEC CORP·Filed 2020·Granted Feb 20, 2024·2 cites·24 claims
- 0486US7482701B2Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor devicePANASONIC CORP·Filed 2007·Granted Jan 27, 2009·15 cites·16 claims
- 0586USD487430SSemiconductor memory elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 9, 2004·36 cites·1 claims
- 0686US2025358226A1Encryption key generationNEC CORP·Filed 2025·Application pending·0 cites
- 0784US7154189B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Dec 26, 2006·10 cites·6 claims
- 0882US10735328B2Information communication system, information communication method and deviceNEC CORP·Filed 2015·Granted Aug 4, 2020·3 cites·7 claims
- 0981US12407613B2Encryption key generationNEC CORP·Filed 2023·Granted Sep 2, 2025·0 cites·16 claims
- 1080US7882957B2Storing tray and storing devicePANASONIC CORP·Filed 2005·Granted Feb 8, 2011·7 cites·11 claims
- 1178US9437517B2Semiconductor apparatus including a heat dissipating memberPANASONIC CORP·Filed 2015·Granted Sep 6, 2016·3 cites·19 claims
- 1271US9605714B2Machining apparatus for machining end face of tapered roller and grinding wheel bodyJTEKT CORP·Filed 2015·Granted Mar 28, 2017·2 cites·6 claims
- 1368US6905912B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 14, 2005·12 cites·2 claims
- 1465US5998866ASemiconductor device having a lead clamping arrangementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 7, 1999·28 cites·13 claims
- 1565US2025213450A1Pore improving agent and skin improving agentHASEGAWA T CO LTD·Filed 2023·Application pending·0 cites
- 1662US7268417B2Card-type circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 11, 2007·11 cites·11 claims
- 1758US5776802ASemiconductor device and manufacturing method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 7, 1998·21 cites·12 claims
- 1857US8125079B2Molded semiconductor device, apparatus for producing the same, and method for manufacturing the sameITO TETSUO·Filed 2007·Granted Feb 28, 2012·1 cites·3 claims
- 1952US7149091B2Electronic circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Dec 12, 2006·6 cites·16 claims
- 2051USD525214SInformation storage semiconductor elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 18, 2006·8 cites·1 claims
- 2149US8039941B2Circuit board, lead frame, semiconductor device, and method for fabricating the samePANASONIC CORP·Filed 2009·Granted Oct 18, 2011·0 cites·5 claims
- 2248USD522978SInformation storage semiconductor elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 13, 2006·7 cites·1 claims
- 2340US2012175788A1Semiconductor device, semiconductor package, and method for manufacturing semiconductor deviceOCHI TAKAO·Filed 2012·Application pending·0 cites
- 2435US2016035647A1Semiconductor device having heat dissipation structure and laminate of semiconductor devicesPANASONIC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →