Inventor · disambiguated record
Takamasa Oda
Also filed as: ODA TAKAMASA
4 granted patents·4 citations·filing 2018–2022
60Inventor score
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0186US11257760B2Semiconductor device having metal wire bonded to plural metal blocks connected to respective circuit patternsMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 22, 2022·2 cites·10 claims
- 0273US10593605B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 17, 2020·2 cites·19 claims
- 0350US12243790B2Semiconductor device and inverter deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Mar 4, 2025·0 cites·13 claims
- 0450US11876033B2Semiconductor device including resin case having groove at corner thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jan 16, 2024·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →