Inventor · disambiguated record
Takamichi Ogawa
Also filed as: OGAWA TAKAMICHI
4 granted patents·2 pending applications·3 citations·filing 2006–2022
61Inventor score
Top patents by PatentIndex Score
6 records- 0160US7750248B2Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structureNGK SPARK PLUG CO·Filed 2006·Granted Jul 6, 2010·2 cites·10 claims
- 0253US8813353B2Method of manufacturing a dielectric structureINUI YASUHIKO·Filed 2010·Granted Aug 26, 2014·1 cites·15 claims
- 0346US2024409468A1Alumina-based sintered body and electrostatic chuckNITERRA CO LTD·Filed 2022·Application pending·0 cites
- 0434US11142484B2Component for semiconductor production device, and production method of component for semiconductor production deviceNGK SPARK PLUG CO·Filed 2017·Granted Oct 12, 2021·0 cites·5 claims
- 0533US11560336B2Method for producing semiconductor production device component, and semiconductor production device componentNGK SPARK PLUG CO·Filed 2017·Granted Jan 24, 2023·0 cites·8 claims
- 0627US2019304813A1Component for semiconductor production deviceNGK SPARK PLUG CO·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →