Inventor · disambiguated record
Takeshi Ohori
Also filed as: OHORI TAKESHI
1 granted patent·2 pending applications·81 citations·filing 1997–2025
52Inventor score
Top patents by PatentIndex Score
3 records- 0180US5984165AMethod of bonding a chip part to a substrate using solder bumpsFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·81 cites·18 claims
- 0260US2025246663A1Stacking apparatusHONDA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0360US2025246662A1Positioning deviceHONDA MOTOR CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →