Inventor · disambiguated record
Takashi Ohsumi
Also filed as: OHSUMI TAKASHI
20 granted patents·2 pending applications·432 citations·filing 1997–2010
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
22 records- 0197US6765299B2Semiconductor device and the method for manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 20, 2004·166 cites·18 claims
- 0288US6841875B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 11, 2005·51 cites·20 claims
- 0385US6097091ASemiconductor apparatus having an insulating layer of varying height thereinOKI ELECTRIC IND CO LTD·Filed 1997·Granted Aug 1, 2000·55 cites·17 claims
- 0481US6281111B1Semiconductor apparatus and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 28, 2001·21 cites·18 claims
- 0580US7045908B2Semiconductor device and method for manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 16, 2006·30 cites·5 claims
- 0678US6303470B1Semiconductor wafer and method for manufacturing semiconductor devicesOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 16, 2001·21 cites·12 claims
- 0777US6893943B2Method of dividing a semiconductor waferOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 17, 2005·19 cites·9 claims
- 0871US7915746B2Semiconductor wafer, and semiconductor device formed therefromOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Mar 29, 2011·4 cites·19 claims
- 0971US6590274B2Semiconductor wafer and method for manufacturing semiconductor devicesOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 8, 2003·14 cites·4 claims
- 1068US8211750B2Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method thereforOHSUMI TAKASHI·Filed 2008·Granted Jul 3, 2012·4 cites·2 claims
- 1167US6713319B2Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stressOKI ELECTRIC IND CO LTD·Filed 2001·Granted Mar 30, 2004·9 cites·3 claims
- 1263US7528005B2Method of manufacturing chip size package semiconductor device without intermediate substrateOKI SEMICONDUCTOR CO LTD·Filed 2004·Granted May 5, 2009·9 cites·7 claims
- 1362US7358608B2Semiconductor device having chip size package with improved strengthOKI ELECTRIC IND CO LTD·Filed 2004·Granted Apr 15, 2008·10 cites·2 claims
- 1461US7129579B2Semiconductor apparatus and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2003·Granted Oct 31, 2006·6 cites·8 claims
- 1557US7667315B2Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips thereinOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Feb 23, 2010·1 cites·13 claims
- 1650US6979592B2Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stressOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 27, 2005·2 cites·2 claims
- 1748US7180185B2Semiconductor device with connections for bump electrodesOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 20, 2007·3 cites·5 claims
- 1843US8164164B2Semiconductor wafer, and semiconductor device formed therefromOHSUMI TAKASHI·Filed 2010·Granted Apr 24, 2012·0 cites·14 claims
- 1943US2006065964A1Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method thereforOHSUMI TAKASHI·Filed 2005·Application pending·0 cites
- 2042US2005059200A1Semiconductor apparatus and method for fabricating the sameFiled 2004·Application pending·0 cites
- 2139US6852617B2Semiconductor device fabrication methodOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 8, 2005·0 cites·26 claims
- 2238US6331449B1Method of forming a dicing area of a semicondutor substrateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Dec 18, 2001·7 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →