Inventor · disambiguated record
Takahiro Oka
Also filed as: OKA TAKAHIRO
40 granted patents·6 pending applications·2,149 citations·filing 1982–2021
98Inventor score
Files withCHISSO CORP16OKI ELECTRIC IND CO LTD11MURATA MANUFACTURING CO7KOBELCO CONSTR MACH CO LTD2OKA TAKAHIRO2
Top patents by PatentIndex Score
46 records- 0198US8722546B2Method for forming silicon-containing dielectric film by cyclic deposition with side wall coverage controlFUKAZAWA ATSUKI·Filed 2012·Granted May 13, 2014·554 cites·20 claims
- 0297US8569184B2Method for forming single-phase multi-element film by PEALDOKA TAKAHIRO·Filed 2011·Granted Oct 29, 2013·518 cites·20 claims
- 0397US8197915B2Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperatureOKA TAKAHIRO·Filed 2009·Granted Jun 12, 2012·529 cites·19 claims
- 0494US6355725B2Propylene-ethylene block copolymer compositions and processes for production thereofCHISSO CORP·Filed 2001·Granted Mar 12, 2002·62 cites·7 claims
- 0590US6551906B2Method of fabricating semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Apr 22, 2003·71 cites·8 claims
- 0689US6211300B1Propylene-ethylene block copolymer compositions and processes for production thereofCHISSO CORP·Filed 1998·Granted Apr 3, 2001·57 cites·4 claims
- 0783US6174751B1Method of manufacturing resin encapsulated semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jan 16, 2001·41 cites·22 claims
- 0877US7211883B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2005·Granted May 1, 2007·7 cites·10 claims
- 0974US5461115AContinuous production process of a propylene-ethylene block copolymerCHISSO CORP·Filed 1994·Granted Oct 24, 1995·25 cites·3 claims
- 1071US10669131B2Construction machine equipped with boomKOBELCO CONSTR MACH CO LTD·Filed 2017·Granted Jun 2, 2020·2 cites·4 claims
- 1169US4771103AProcess for continuously producing propylene-ethylene block copolymerCHISSO CORP·Filed 1986·Granted Sep 13, 1988·19 cites·6 claims
- 1268US5532325AProcess for producing high stiffness polypropyleneCHISSO CORP·Filed 1995·Granted Jul 2, 1996·23 cites·6 claims
- 1368US4500682AHigh melt-viscoelastic polypropylene for post-processed sheets and for blow moldingCHISSO CORP·Filed 1983·Granted Feb 19, 1985·16 cites·4 claims
- 1467US4760113AProcess for continuously producing a high-melt viscoelastic ethylene-propylene copolymerCHISSO CORP·Filed 1986·Granted Jul 26, 1988·18 cites·2 claims
- 1567US4550144APropylene-ethylene copolymers for high-rigidity molded products and process for producing the sameCHISSO CORP·Filed 1983·Granted Oct 29, 1985·16 cites·10 claims
- 1666US6084300ACompact resin-sealed semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Jul 4, 2000·34 cites·6 claims
- 1766US4510292AEthylene-propylene copolymers for foaming and process for producing the sameCHISSO CORP·Filed 1983·Granted Apr 9, 1985·20 cites·4 claims
- 1865US4522994APolypropylene resin for high-rigidity molded productsCHISSO CORP·Filed 1982·Granted Jun 11, 1985·14 cites·3 claims
- 1964US7075177B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 11, 2006·11 cites·17 claims
- 2063US7907241B2Liquid crystal display deviceSHARP KK·Filed 2006·Granted Mar 15, 2011·2 cites·3 claims
- 2162US6472729B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Oct 29, 2002·29 cites·25 claims
- 2261US4582878AHigh-rigidity ethylene-propylene copolymer and process for producing sameCHISSO CORP·Filed 1984·Granted Apr 15, 1986·20 cites·14 claims
- 2359US10638603B2Multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 2459US6831354B2Semiconductor package and method of fabricating sameOKI ELECTRIC IND CO LTD·Filed 2001·Granted Dec 14, 2004·7 cites·13 claims
- 2559US4499247AHigh-rigidity, high-melt-viscoelasticity polypropylene and process for producing the sameCHISSO CORP·Filed 1983·Granted Feb 12, 1985·12 cites·6 claims
- 2658US4970280AContinuous process for producing high molten viscoelastic polypropylene or ethylene-propylene copolymerCHISSO CORP·Filed 1988·Granted Nov 13, 1990·12 cites·5 claims
- 2757US8038811B2Process for producing bent pipe for line pipeSUMITOMO METAL IND·Filed 2009·Granted Oct 18, 2011·0 cites·1 claims
- 2856US10485099B2Multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2018·Granted Nov 19, 2019·0 cites·17 claims
- 2952US7067357B2Semiconductor package and method of fabricating sameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Jun 27, 2006·4 cites·15 claims
- 3051US10292264B2Insulating ceramic paste, ceramic electronic component, and method for producing the sameMURATA MANUFACTURING CO·Filed 2018·Granted May 14, 2019·0 cites·2 claims
- 3149US6777264B2Method of manufacturing a semiconductor device having a die pad without a downsetOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 17, 2004·3 cites·14 claims
- 3249US2023271813A1Combination of units for work machineKOBELCO CONSTR MACH CO LTD·Filed 2021·Application pending·0 cites
- 3346US5672658AHighly stiff propylene-ethylene block copolymer composition and a process for producing the sameCHISSO CORP·Filed 1995·Granted Sep 30, 1997·9 cites·1 claims
- 3445US9974168B2Insulating ceramic paste, ceramic electronic component, and method for producing the sameMURATA MANUFACTURING CO·Filed 2015·Granted May 15, 2018·0 cites·7 claims
- 3544US11230499B2Ceramic electronic componentMURATA MANUFACTURING CO·Filed 2018·Granted Jan 25, 2022·0 cites·8 claims
- 3641US5140062AContinuous process for producing high molten viscoelastic polypropylene of ethylene-propylene copolymerCHISSO CORP·Filed 1990·Granted Aug 18, 1992·5 cites·3 claims
- 3740US6948239B2Method for fabricating semiconductor apparatus using board frameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Sep 27, 2005·0 cites·17 claims
- 3840US5854355AContinuous process for preparation of highly rigid propylene-ethylene block copolymersCHISSO CORP·Filed 1997·Granted Dec 29, 1998·6 cites·11 claims
- 3939US2010171914A1Composite retardation plate, and optical compensation polarizing plate and liquid crystal display device equipped with composite retardation plateMORISHITA KATSUHIKO·Filed 2008·Application pending·0 cites
- 4038US2019191565A1Electronic device and multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2019·Application pending·0 cites
- 4136US2001023994A1Semiconductor device and the method for manufacturing the sameFiled 2001·Application pending·0 cites
- 4236US2010110318A1Liquid crystal display deviceOGAWA KATSUYA·Filed 2007·Application pending·0 cites
- 4335US11350523B2Ceramic wiring board and method for producing the sameMURATA MANUFACTURING CO·Filed 2017·Granted May 31, 2022·0 cites·17 claims
- 4434US7460128B2Image drawing apparatusFUJITSU LTD·Filed 2005·Granted Dec 2, 2008·0 cites·12 claims
- 4532US6512287B1Board frame, method for fabricating thereof and method for fabricating semiconductor apparatusOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jan 28, 2003·3 cites·9 claims
- 4621US2001011768A1Semiconductor integrated circuit device and package structure for the sameFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →