Inventor · disambiguated record
Tadahiro Okamoto
Also filed as: OKAMOTO TADAHIRO
8 granted patents·3 pending applications·233 citations·filing 1987–2008
88Inventor score
Top patents by PatentIndex Score
11 records- 0193US7064436B2Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·81 cites·2 claims
- 0293US6794273B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·81 cites·8 claims
- 0384US6680241B2Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devicesFUJITSU LTD·Filed 2000·Granted Jan 20, 2004·40 cites·7 claims
- 0475US7754534B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 13, 2010·5 cites·27 claims
- 0568US7355124B2Multilayer wiring board and its manufacturing methodFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
- 0664US7723847B2Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetweenFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted May 25, 2010·3 cites·4 claims
- 0754US7915538B2Multilayer wiring board and its manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Mar 29, 2011·0 cites·1 claims
- 0850US4787951AMethod and apparatus for adhering a tape or sheet to a semiconductor waferFUJITSU LTD·Filed 1987·Granted Nov 29, 1988·19 cites·20 claims
- 0946US2006258045A1Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1041US2004232549A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 1140US2006214296A1Semiconductor device and semiconductor-device manufacturing methodFUJITSU LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →