Inventor · disambiguated record
Tadayuki Okawa
Also filed as: OKAWA TADAYUKI
6 granted patents·5 pending applications·47 citations·filing 1975–2024
78Inventor score
Top patents by PatentIndex Score
11 records- 0177US10998857B2Resonance deviceMURATA MANUFACTURING CO·Filed 2020·Granted May 4, 2021·1 cites·20 claims
- 0260US4008858ATreating device for synthetic resin wasteMITSUBISHI PETROCHEMICAL CO·Filed 1975·Granted Feb 22, 1977·22 cites·3 claims
- 0357US2024286890A1Double layer mems devicesMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0455US11629046B2MEMS deviceMURATA MANUFACTURING CO·Filed 2020·Granted Apr 18, 2023·0 cites·14 claims
- 0555US2023261635A1Piezoelectric vibration element, piezoelectric vibrator, and piezoelectric oscillatorMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0654US6156672AMethod of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin filmMURATA MANUFACTURING CO·Filed 1999·Granted Dec 5, 2000·21 cites·6 claims
- 0752US2023246625A1Piezoelectric vibrator, piezoelectric oscillator, and piezoelectric vibrator manufacturing methodMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0849US6655024B2Method of manufacturing a circuit boardMURATA MANUFACTURING CO·Filed 2002·Granted Dec 2, 2003·3 cites·17 claims
- 0939US10177289B2Mounting substrateMURATA MANUFACTURING CO·Filed 2017·Granted Jan 8, 2019·0 cites·12 claims
- 1034US2016079218A1Electrostatic protection device and light-emitting moduleMURATA MANUFACTURING CO·Filed 2015·Application pending·0 cites
- 1124US2002076660A1Method of forming wiring patternFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →