Inventor · disambiguated record
Takeo Oku
Also filed as: OKU TAKEO
8 granted patents·183 citations·filing 1994–2011
87Inventor score
Top patents by PatentIndex Score
8 records- 0189US5744394AMethod for fabricating a semiconductor device having copper layerSHARP KK·Filed 1997·Granted Apr 28, 1998·84 cites·4 claims
- 0283US5973400ASemiconductor device having a copper wiring layer formed on a base via a barrier layer of amorphous tantalum carbideSHARP KK·Filed 1997·Granted Oct 26, 1999·74 cites·6 claims
- 0379US8323374B2Fine composite metal particles and their production method, micro-bodies, and magnetic beadsKANEKO YASUSHI·Filed 2011·Granted Dec 4, 2012·2 cites·6 claims
- 0446US5767007AMethod for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrodeSONY CORP·Filed 1994·Granted Jun 16, 1998·8 cites·55 claims
- 0541US6033976AOhmic electrode, its fabricating method and semiconductor deviceSONY CORP·Filed 1997·Granted Mar 7, 2000·6 cites·68 claims
- 0638US5982036AMulti-layered structure for ohmic electrode fabricationSONY CORP·Filed 1997·Granted Nov 9, 1999·4 cites·18 claims
- 0737US5747878AOhmic electrode, its fabrication method and semiconductor deviceSONY CORP·Filed 1997·Granted May 5, 1998·4 cites·19 claims
- 0831US5904554AMethod for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrodeSONY CORP·Filed 1997·Granted May 18, 1999·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →