Inventor · disambiguated record
Takahiro Onakado
Also filed as: ONAKADO TAKAHIRO
12 granted patents·298 citations·filing 1997–2017
91Inventor score
Top patents by PatentIndex Score
12 records- 0193US5818761ANon-volatile semiconductor memory device capable of high speed programming/erasureMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 6, 1998·120 cites·20 claims
- 0283US6469339B1Semiconductor memory with voids for suppressing crystal defectsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 22, 2002·38 cites·9 claims
- 0382US9184209B2TDI-type linear image sensorONAKADO TAKAHIRO·Filed 2012·Granted Nov 10, 2015·3 cites·16 claims
- 0481US6107659ANonvolatile semiconductor memory device operable at high speed with low power supply voltage while preventing overerasing/overwritingMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 22, 2000·51 cites·20 claims
- 0580US9209218B2Infrared solid-state imaging deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Dec 8, 2015·2 cites·17 claims
- 0675US8431900B2Infrared solid-state imaging deviceONAKADO TAKAHIRO·Filed 2011·Granted Apr 30, 2013·4 cites·10 claims
- 0774US6014328AMemory cell allowing write and erase with low voltage power supply and nonvolatile semiconductor memory device provided with the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jan 11, 2000·32 cites·3 claims
- 0868US6555868B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 29, 2003·15 cites·8 claims
- 0966US5978264ANonvolatile semiconductor memory device operable at high speed with low power supply voltage while suppressing increase of chip areaMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 2, 1999·27 cites·20 claims
- 1056US6417540B1Non-volatile semiconductor memory device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 9, 2002·6 cites·6 claims
- 1154US8357900B2Thermal infrared detecting deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Jan 22, 2013·0 cites·19 claims
- 1240US10847567B2Infrared sensor device including infrared sensor substrate and signal processing circuit substrate coupled to each otherMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 24, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →