Inventor · disambiguated record
Takashi Oobayashi
Also filed as: OOBAYASHI TAKASHI
2 granted patents·277 citations·filing 1996–1999
72Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD2
Top patents by PatentIndex Score
2 records- 0193US5641996ASemiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packagingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 24, 1997·190 cites·29 claims
- 0284US6139777AConductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 31, 2000·87 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →