Inventor · disambiguated record
Takukazu Otsuka
Also filed as: OTSUKA TAKUKAZU
26 granted patents·8 pending applications·38 citations·filing 2008–2025
94Inventor score
Top patents by PatentIndex Score
34 records- 0195US11189586B2Semiconductor device and fabrication method of the semiconductor deviceROHM CO LTD·Filed 2020·Granted Nov 30, 2021·3 cites·17 claims
- 0288US11658140B2Semiconductor device and fabrication method of the semiconductor deviceROHM CO LTD·Filed 2021·Granted May 23, 2023·1 cites·18 claims
- 0387US11848295B2Power semiconductor apparatus and fabrication method for the sameROHM CO LTD·Filed 2022·Granted Dec 19, 2023·1 cites·15 claims
- 0486US10790247B2Semiconductor device and fabrication method of the semiconductor deviceROHM CO LTD·Filed 2018·Granted Sep 29, 2020·3 cites·14 claims
- 0583US9379634B2Semiconductor deviceROHM CO LTD·Filed 2015·Granted Jun 28, 2016·3 cites·9 claims
- 0682US8513806B2Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor deviceOTSUKA TAKUKAZU·Filed 2011·Granted Aug 20, 2013·7 cites·15 claims
- 0781US12074129B2Semiconductor device and fabrication method of the semiconductor deviceROHM CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·14 claims
- 0879US11302665B2Power semiconductor apparatus and fabrication method for the sameROHM CO LTD·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 0978US12191275B2Power semiconductor apparatus and fabrication method for the sameROHM CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·29 claims
- 1078US2024332122A1Power module and fabrication method of the same, graphite plate, and power supply equipmentROHM CO LTD·Filed 2024·Application pending·0 cites
- 1176US7773381B2Semiconductor deviceROHM CO LTD·Filed 2008·Granted Aug 10, 2010·4 cites·9 claims
- 1273US12046532B2Power module and fabrication method of the same, graphite plate, and power supply equipmentROHM CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·23 claims
- 1373US9673163B2Semiconductor device with flip chip structure and fabrication method of the semiconductor deviceOTSUKA TAKUKAZU·Filed 2011·Granted Jun 6, 2017·4 cites·17 claims
- 1473US8208260B2Semiconductor deviceOKUMURA KEIJI·Filed 2010·Granted Jun 26, 2012·2 cites·9 claims
- 1572US12176271B2Semiconductor deviceROHM CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·16 claims
- 1672US11842949B2Semiconductor deviceROHM CO LTD·Filed 2019·Granted Dec 12, 2023·1 cites·15 claims
- 1766US7732917B2Power moduleROHM CO LTD·Filed 2008·Granted Jun 8, 2010·3 cites·29 claims
- 1864US8410600B2Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting filmLOSTETTER ALEXANDER B·Filed 2010·Granted Apr 2, 2013·3 cites·16 claims
- 1957US2024055355A1Semiconductor apparatusROHM CO LTD·Filed 2023·Application pending·0 cites
- 2055US11367669B2Power module and fabrication method of the same, graphite plate, and power supply equipmentROHM CO LTD·Filed 2017·Granted Jun 21, 2022·0 cites·19 claims
- 2154US8971044B2Semiconductor deviceOKUMURA KEIJI·Filed 2012·Granted Mar 3, 2015·0 cites·17 claims
- 2254US8592986B2High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor deviceOTSUKA TAKUKAZU·Filed 2010·Granted Nov 26, 2013·1 cites·10 claims
- 2353US11171071B2Power module and fabrication method of the power moduleROHM CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·15 claims
- 2452US12376349B2Semiconductor device with switching elements connected in seriesROHM CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·19 claims
- 2551US7864533B2Semiconductor deviceROHM CO LTD·Filed 2010·Granted Jan 4, 2011·0 cites·20 claims
- 2651US2023411338A1Semiconductor deviceROHM CO LTD·Filed 2021·Application pending·0 cites
- 2750US2024014193A1Semiconductor deviceROHM CO LTD·Filed 2021·Application pending·0 cites
- 2848US2025293110A1Semiconductor module and power conversion unitROHM CO LTD·Filed 2025·Application pending·0 cites
- 2947US12506123B2Semiconductor deviceROHM CO LTD·Filed 2020·Granted Dec 23, 2025·0 cites·20 claims
- 3047US11972997B2Semiconductor deviceROHM CO LTD·Filed 2019·Granted Apr 30, 2024·0 cites·14 claims
- 3147US2009166893A1Semiconductor deviceROHM CO LTD·Filed 2008·Application pending·0 cites
- 3246US2009091892A1Semiconductor DeviceROHM CO LTD·Filed 2008·Application pending·0 cites
- 3344US2011012132A1Semiconductor DeviceROHM CO LTD·Filed 2009·Application pending·0 cites
- 3438US9761506B2Semiconductor device and fabrication method for the sameOTSUKA TAKUKAZU·Filed 2012·Granted Sep 12, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →