Inventor · disambiguated record
Takuo Ozawa
Also filed as: OZAWA TAKUO
3 granted patents·51 citations·filing 2000–2004
70Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0182US6241145B1Lead-free solder joining method and electronic module manufactured by using the methodMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 5, 2001·41 cites·5 claims
- 0254US7078330B2Metal electrode and bonding method using the metal electrodeMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jul 18, 2006·6 cites·1 claims
- 0346US6722614B2Satellite deployment structureMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Apr 20, 2004·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →