Inventor · disambiguated record
Taejae Park
Also filed as: PARK TAEJAE
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0158US2025079232A1Semiconductor package bonding tool and semiconductor package fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025201757A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2025219014A1Semiconductor reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →