Inventor · disambiguated record
Taegyun Park
Also filed as: PARK TAEGYUN
7 granted patents·9 pending applications·13 citations·filing 2012–2024
76Inventor score
Top patents by PatentIndex Score
16 records- 0185US9033029B2Heat exchangerPARK TAEGYUN·Filed 2012·Granted May 19, 2015·8 cites·20 claims
- 0273US9429373B2Heat exchangerPARK TAEGYUN·Filed 2012·Granted Aug 30, 2016·2 cites·19 claims
- 0370US10544990B2Heat exchangerLG ELECTRONICS INC·Filed 2016·Granted Jan 28, 2020·1 cites·11 claims
- 0468US10551127B2Heat exchangerLG ELECTRONICS INC·Filed 2013·Granted Feb 4, 2020·1 cites·3 claims
- 0565US9557121B2Heat exchangerLG ELECTRONICS INC·Filed 2013·Granted Jan 31, 2017·1 cites·4 claims
- 0665US2025172350A1Heat exchangerLG ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0765US2025155204A1Heat exchanger and clothing processing equipment having the sameLG ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0864US2014284035A1Heat exchangerLG ELECTRONICS INC·Filed 2014·Application pending·0 cites
- 0962US2025154712A1Clothing processing equipmentLG ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1062US2024230237A1Heat exchangerLG ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1156US2016377347A1Heat exchangerLG ELECTRONICS INC·Filed 2016·Application pending·0 cites
- 1250US11592222B2Condenser for refrigeratorLG ELECTRONICS INC·Filed 2018·Granted Feb 28, 2023·0 cites·20 claims
- 1345US2021131749A1Heat exchanger of refrigeratorLG ELECTRONICS INC·Filed 2018·Application pending·0 cites
- 1441US11041676B2Heat exchangerLG ELECTRONICS INC·Filed 2016·Granted Jun 22, 2021·0 cites·7 claims
- 1537US2015226498A1Heat exchangerLG ELECTRONICS INC·Filed 2015·Application pending·0 cites
- 1634US2015226495A1Heat exchangerLG ELECTRONICS INC·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Taegyun Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →