Inventor · disambiguated record
Takatoshi Sasaki
Also filed as: SASAKI TAKATOSHI
4 granted patents·14 pending applications·1 citations·filing 2004–2020
56Inventor score
Top patents by PatentIndex Score
18 records- 0154US12055213B2Transfer system of work machine, work machine, and method of predicting lifetime of transfer system in work machineKOMATSU MFG CO LTD·Filed 2020·Granted Aug 6, 2024·0 cites·8 claims
- 0249US12105025B2Inspection device for hydraulic equipment, inspection system for hydraulic equipment, work vehicle, and inspection method for hydraulic equipmentKOMATSU MFG CO LTD·Filed 2020·Granted Oct 1, 2024·0 cites·13 claims
- 0349US7115680B2Hydrophilized porous film and process for producing the sameNITTO DENKO CORP·Filed 2004·Granted Oct 3, 2006·1 cites·8 claims
- 0448US2008057306A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0545US11254844B2Pressure-sensitive adhesive tape for protecting semiconductorNITTO DENKO CORP·Filed 2019·Granted Feb 22, 2022·0 cites·4 claims
- 0645US2009314417A1Method of grinding back side of semiconductor wafer and adhesive sheet for use in the method of grinding back side of semiconductor waferNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0744US2011097576A1Re-peelable adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0843US2008085397A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0943US2008138618A1Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1041US2008057253A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1141US2008057270A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1241US2008182095A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1341US2008108262A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1437US2009311474A1Adhesive sheet for water jet laser dicingTAKAHASHI TOMOKAZU·Filed 2008·Application pending·0 cites
- 1537US2013122688A1Pressure-sensitive adhesive sheet for dicing and method of manufacturing semiconductor device using pressure-sensitive adhesive sheet for dicingSASAKI TAKATOSHI·Filed 2012·Application pending·0 cites
- 1632US2011030882A1Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor waferNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1732US2011008597A1Surface protective sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1832US2011030881A1Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor waferNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →