Inventor · disambiguated record
Tadaji Satou
Also filed as: SATOU TADAJI
3 granted patents·83 citations·filing 1989–2000
73Inventor score
Files withHITACHI CHEMICAL CO LTD3
Top patents by PatentIndex Score
3 records- 0178US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0269US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 0329US4986869AMethod employing input and output staging chamber devices for reduced pressure laminationHITACHI CHEMICAL CO LTD·Filed 1989·Granted Jan 22, 1991·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →