Inventor · disambiguated record
Takashi Sawada
Also filed as: KURIHARA TOSHIO · SAWADA TAKASHI
123 granted patents·20 pending applications·1,632 citations·filing 1977–2024
99Inventor score
Files withMURATA MANUFACTURING CO46SONY CORP22MEGA CHIPS CORP17CANON KK7NIPPON TELEGRAPH & TELEPHONE7
Top patents by PatentIndex Score
143 records- 0198US7671493B2Vibration assembly, input device using the vibration assembly, and electronic equipment using the input deviceSONY CORP·Filed 2008·Granted Mar 2, 2010·134 cites·7 claims
- 0297US8547341B2Touch-sensitive sheet member, input device and electronic apparatusTAKASHIMA KOUICHIRO·Filed 2008·Granted Oct 1, 2013·55 cites·3 claims
- 0397US5738731APhotovoltaic deviceMEGA CHIPS CORP·Filed 1994·Granted Apr 14, 1998·236 cites·6 claims
- 0496US6848781B2Image forming process, image-recorded article, liquid composition and ink-jet recording apparatusCANON KK·Filed 2003·Granted Feb 1, 2005·59 cites·12 claims
- 0594US9773619B2Multilayer capacitor and installation structure of multilayer capacitorMURATA MANUFACTURING CO·Filed 2016·Granted Sep 26, 2017·6 cites·4 claims
- 0694US7867586B2Article having microporous body part, production method of ink medium, diffusion method of sulfur-containing organic acid into microporous layer, production method of article having meicroporous body part, and inkjet recording medium produced therefromCANON KK·Filed 2006·Granted Jan 11, 2011·18 cites·8 claims
- 0794US5541796ACassette case board and release part for recording medium cassetteSONY CORP·Filed 1994·Granted Jul 30, 1996·71 cites·6 claims
- 0894US4111464APipe joint locking ring and groove arrangementSEIKISUI CHEMICAL CO LTD·Filed 1977·Granted Sep 5, 1978·109 cites·9 claims
- 0993US9087643B1Multilayer capacitor and installation structure of multilayer capacitorMURATA MANUFACTURING CO·Filed 2014·Granted Jul 21, 2015·19 cites·7 claims
- 1093US7291361B2Image forming process, image-recorded article, liquid composition and ink-jet recording apparatusCANON KK·Filed 2004·Granted Nov 6, 2007·29 cites·4 claims
- 1191US10249436B2Multilayer ceramic electronic component including external electrodes and insulating coating portionsMURATA MANUFACTURING CO·Filed 2017·Granted Apr 2, 2019·5 cites·20 claims
- 1291US9633787B2Multilayer capacitor and installation structure of multilayer capacitorMURATA MANUFACTURING CO·Filed 2015·Granted Apr 25, 2017·4 cites·12 claims
- 1391US9627143B2Multilayer ceramic electronic component including a pair of side outer electrodes and a center electrodeMURATA MANUFACTURING CO·Filed 2015·Granted Apr 18, 2017·5 cites·19 claims
- 1491US9060461B2Laminated ceramic electronic component, manufacturing method therefor, serial taping electronic component, manufacturing method therefor, and direction identification method for laminated ceramic electronic componentMURATA MANUFACTURING CO·Filed 2013·Granted Jun 16, 2015·9 cites·24 claims
- 1590US9214282B1Three-terminal capacitorMURATA MANUFACTURING CO·Filed 2014·Granted Dec 15, 2015·9 cites·1 claims
- 1690US8223130B2Touch-sensitive sheet member, input device and electronic apparatusTAKASHIMA KOUICHIRO·Filed 2008·Granted Jul 17, 2012·11 cites·33 claims
- 1789US9111682B2Multilayer ceramic electronic componentSAWADA TAKASHI·Filed 2012·Granted Aug 18, 2015·9 cites·8 claims
- 1889US8988851B1Capacitor including four terminal electrodesMURATA MANUFACTURING CO·Filed 2014·Granted Mar 24, 2015·6 cites·3 claims
- 1988US8265322B2HeadphoneUCHIDA HIROSHI·Filed 2010·Granted Sep 11, 2012·11 cites·7 claims
- 2087US9658694B2Touch-sensitive sheet member, input device and electronic apparatusSONY CORP·Filed 2015·Granted May 23, 2017·4 cites·12 claims
- 2187US9330843B2Multilayer ceramic electronic component including a pair of side outer electrodes and a center electrodeMURATA MANUFACTURING CO·Filed 2015·Granted May 3, 2016·4 cites·15 claims
- 2286US10361033B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2017·Granted Jul 23, 2019·3 cites·16 claims
- 2386US9715968B2Multilayer capacitor and installation structure of multilayer capacitorMURATA MANUFACTURING CO·Filed 2016·Granted Jul 25, 2017·2 cites·7 claims
- 2486US9287048B2Capacitor including first, second, third, and fourth terminal electrodesMURATA MANUFACTURING CO·Filed 2015·Granted Mar 15, 2016·3 cites·16 claims
- 2585US8582033B2Movie reproduction system and movie reproduction method for reducing delay time of reproduced movieSAWADA TAKASHI·Filed 2010·Granted Nov 12, 2013·7 cites·18 claims
- 2685US6025252ASemiconductor device and method of fabricating the sameMEGA CHIPS CORP·Filed 1997·Granted Feb 15, 2000·49 cites·54 claims
- 2784US8264463B2Input device and electronic apparatusTAKASHIMA KOUICHIRO·Filed 2008·Granted Sep 11, 2012·17 cites·16 claims
- 2884US6186100B1Valve assembly for internal combustion engineNISSAN MOTOR·Filed 1999·Granted Feb 13, 2001·40 cites·15 claims
- 2984US6177706B1Field-effect thin-film transistor deviceMEGA CHIPS CORP·Filed 1997·Granted Jan 23, 2001·47 cites·5 claims
- 3083US9741491B2Multilayer ceramic electronic component including a pair of side outer electrodes and a center electrodeMURATA MANUFACTURING CO·Filed 2017·Granted Aug 22, 2017·2 cites·11 claims
- 3183US9633784B2Electronic componentMURATA MANUFACTURING CO·Filed 2014·Granted Apr 25, 2017·4 cites·20 claims
- 3283US5434721ARecording/reproducing apparatus for recording/reproducing information to and/or from a plurality of types of recording medium cassettesSONY CORP·Filed 1993·Granted Jul 18, 1995·33 cites·6 claims
- 3382US5694496AOptical waveplate and A method of manufacturing the optical waveplateNIPPON TELEGRAPH & TELEPHONE·Filed 1996·Granted Dec 2, 1997·42 cites·3 claims
- 3481US9570234B2Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2015·Granted Feb 14, 2017·3 cites·16 claims
- 3581US7605683B2Monolithic electronic componentMURATA MANUFACTURING CO·Filed 2008·Granted Oct 20, 2009·11 cites·13 claims
- 3681US6677214B1Semiconductor device and method of fabricating the sameMEGA CHIPS CORP·Filed 2000·Granted Jan 13, 2004·29 cites·1 claims
- 3781US6225668B1Semiconductor device having a single crystal gate electrode and insulationMEGA CHIPS CORP·Filed 1997·Granted May 1, 2001·39 cites·17 claims
- 3880US10546692B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2017·Granted Jan 28, 2020·2 cites·19 claims
- 3980US9455086B2Laminated ceramic electronic componentMURATA MANUFACTURING CO·Filed 2013·Granted Sep 27, 2016·3 cites·5 claims
- 4080US7793651B2Heat storage apparatusPANASONIC CORP·Filed 2006·Granted Sep 14, 2010·11 cites·13 claims
- 4180US6115514AOptical waveplate, method of manufacturing the same, and waveguide device using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1998·Granted Sep 5, 2000·36 cites·13 claims
- 4277US9244531B2Touch-sensitive sheet member, input device and electronic apparatusSONY CORP·Filed 2013·Granted Jan 26, 2016·3 cites·5 claims
- 4377US5901259AOptical waveplate, method of manufacturing the same, and waveguide device using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1997·Granted May 4, 1999·33 cites·2 claims
- 4477US4970994AIntake manifold for V-type internal combustion engineNISSAN MOTOR·Filed 1990·Granted Nov 20, 1990·33 cites·12 claims
- 4576US10504652B2Electronic componentMURATA MANUFACTURING CO·Filed 2017·Granted Dec 10, 2019·2 cites·21 claims
- 4674US10395833B2Method for manufacturing a laminated ceramic electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted Aug 27, 2019·1 cites·4 claims
- 4774US6137120ASemiconductor device and method of fabricating the sameMEGA CHIPS CORP·Filed 1997·Granted Oct 24, 2000·28 cites·3 claims
- 4874US6072920AOptical waveplate, method of manufacturing the same, and waveguide device using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1999·Granted Jun 6, 2000·17 cites·26 claims
- 4973US10109423B2Electronic component and mounting structure of electronic componentMURATA MANUFACTURING CO·Filed 2014·Granted Oct 23, 2018·2 cites·4 claims
- 5071US10917080B2Gate drive circuitROHM CO LTD·Filed 2017·Granted Feb 9, 2021·2 cites·7 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →