Inventor · disambiguated record
Takeshi Sawai
Also filed as: SAWAI TAKESHI
14 granted patents·5 pending applications·413 citations·filing 1989–2025
93Inventor score
Top patents by PatentIndex Score
19 records- 0194US6013724ARaindrop fouling-resistant paint film, coating composition, film-forming method, and coated articleNIPPON PAINT CO LTD·Filed 1998·Granted Jan 11, 2000·148 cites·44 claims
- 0288US5733644ACurable composition and method for preparing the sameMITSUBISHI CHEM CORP·Filed 1995·Granted Mar 31, 1998·67 cites·18 claims
- 0384US6599976B2Coating process and silicon-containing liquid compositionMITSUBISHI CHEM CORP·Filed 2001·Granted Jul 29, 2003·29 cites·1 claims
- 0480US6258969B1Polyalkoxysiloxane and process for its productionMITSUBISHI CHEM CORP·Filed 1996·Granted Jul 10, 2001·36 cites·18 claims
- 0577US6251981B1Polyalkoxysiloxane compounds, process for producing the same, and coating composition containing the sameMITSUBISHI CHEMICAL COMPANY·Filed 1998·Granted Jun 26, 2001·40 cites·17 claims
- 0671US6287701B1Resin compositions, processes for their production and their usesCHUO RIKA KOGYO CORP·Filed 1999·Granted Sep 11, 2001·37 cites·17 claims
- 0768US6291697B1Siloxane compounds, process for preparing the same, and liquid composition containing the sameMITSUBISHI CHEM CORP·Filed 1997·Granted Sep 18, 2001·22 cites·11 claims
- 0868US5800606AUltrafine reactive silica particles, suspension containing the same, and hard coating compositionMITSUBISHI CHEM CORP·Filed 1994·Granted Sep 1, 1998·20 cites·20 claims
- 0961US2025297136A1Silica particle, method for producing silica particle, silica sol, polishing composition, polishing method, method for manufacturing semiconductor wafer, and method for manufacturing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2025·Application pending·0 cites
- 1059US10905635B2Gas-containing base material and manufacturing method thereforSHINRYO CORP·Filed 2018·Granted Feb 2, 2021·0 cites·4 claims
- 1158US6835322B2Composition for member preventing accretion of snow or ice and member preventing accretion of snow or ice using the sameHOKKAIDO·Filed 2001·Granted Dec 28, 2004·7 cites·19 claims
- 1257US12297376B2Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 1357US11862470B2Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 1449US5138014ASilicate compound modified by hydroxyl containing compoundsMITSUBISHI CHEM IND·Filed 1989·Granted Aug 11, 1992·7 cites·3 claims
- 1549US2007178318A1Silicon-containing liquid compositionMITSUBISHI CHEM CORP·Filed 2005·Application pending·0 cites
- 1648US12285823B2Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuitSHINRYO CORP·Filed 2021·Granted Apr 29, 2025·0 cites·9 claims
- 1741US2003207991A1Coating process and silicon-containing liquid compositionMITSUBISHI CHEMICAL CORP DAINI·Filed 2003·Application pending·0 cites
- 1839US2013001816A1Method for recovering silicon and method for producing siliconMITSUBISHI CHEM CORP·Filed 2012·Application pending·0 cites
- 1932US2022395935A1Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method thereforSHINRYO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →