Inventor · disambiguated record
Taketoshi Shikano
Also filed as: SHIKANO TAKETOSHI
20 granted patents·6 pending applications·120 citations·filing 2001–2024
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
26 records- 0195US7855464B2Semiconductor device having a semiconductor chip and resin sealing portionMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Dec 21, 2010·46 cites·18 claims
- 0286US10104775B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 16, 2018·9 cites·13 claims
- 0380US9437460B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 6, 2016·5 cites·5 claims
- 0479US9716072B2Power semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 25, 2017·5 cites·11 claims
- 0577US9627302B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 18, 2017·5 cites·8 claims
- 0671US11107746B2Power semiconductor apparatus and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 31, 2021·2 cites·19 claims
- 0770US7151311B2Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layerMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 19, 2006·19 cites·4 claims
- 0870US6791167B2Resin-molded device and manufacturing apparatus thereofMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 14, 2004·18 cites·14 claims
- 0969US8183094B2Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portionSHIKANO TAKETOSHI·Filed 2010·Granted May 22, 2012·3 cites·2 claims
- 1065US8518751B2Method for manufacturing semiconductor device including removing a resin burrSAKAMOTO KEN·Filed 2011·Granted Aug 27, 2013·2 cites·5 claims
- 1162US9171772B2Semiconductor deviceSHIKANO TAKETOSHI·Filed 2013·Granted Oct 27, 2015·2 cites·7 claims
- 1262US2023335480A1Power semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1362US2025212334A1Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1459US9466548B2Semiconductor device and method of manufacturing semiconductor deviceSAKAMOTO KEN·Filed 2012·Granted Oct 11, 2016·1 cites·20 claims
- 1558US11387173B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 12, 2022·0 cites·4 claims
- 1657US2025259961A1Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1756US2024395678A1Semiconductor device, method of manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1855US12300569B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted May 13, 2025·0 cites·14 claims
- 1955US2025054830A1Semiconductor module, power semiconductor device, method for manufacturing semiconductor module, method for manufacturing power semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2054US10541193B2Lead frame and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 21, 2020·0 cites·5 claims
- 2152US11735509B2Power semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 22, 2023·0 cites·3 claims
- 2248US6753596B1Resin-sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 22, 2004·3 cites·7 claims
- 2343US9691730B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 2442US9947613B2Power semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 17, 2018·0 cites·3 claims
- 2540US8334176B2Method of manufacturing semiconductor deviceSAKAMOTO KEN·Filed 2011·Granted Dec 18, 2012·0 cites·8 claims
- 2632US2002149121A1Base interconnection substrate, manufacturing method thereof, semiconductor device and manfacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →