Inventor · disambiguated record
Takahito Suzuki
Also filed as: SUZUKI TAKAHITO
55 granted patents·27 pending applications·712 citations·filing 1989–2025
98Inventor score
Top patents by PatentIndex Score
82 records- 0198US11098807B2Valve deviceDENSO CORP·Filed 2020·Granted Aug 24, 2021·7 cites·6 claims
- 0296US11333258B2Valve deviceDENSO CORP·Filed 2020·Granted May 17, 2022·9 cites·9 claims
- 0396US8035115B2Semiconductor apparatus, print head, and image forming apparatusOKI DATA KK·Filed 2006·Granted Oct 11, 2011·60 cites·13 claims
- 0495US11560958B2Valve deviceDENSO CORP·Filed 2022·Granted Jan 24, 2023·2 cites·5 claims
- 0593US5111410AMotion analyzing/advising systemOH YOH KEISOKU KENKYUSHO KK·Filed 1990·Granted May 5, 1992·371 cites·23 claims
- 0692US9922554B2Driving environment risk determination apparatus and driving environment risk notification apparatusSUBARU CORP·Filed 2015·Granted Mar 20, 2018·19 cites·19 claims
- 0792US9429867B2Semiconductor apparatus, exposing head, and image forming apparatusOKI DATA KK·Filed 2015·Granted Aug 30, 2016·6 cites·21 claims
- 0892US7847298B2Semiconductor composite apparatus, LED, LED printhead, and image forming apparatusOKI DATA KK·Filed 2006·Granted Dec 7, 2010·13 cites·21 claims
- 0988US5023709AAutomatic follow-up lighting systemAOI STUDIO KABUSHIKI KAISHA·Filed 1989·Granted Jun 11, 1991·116 cites·12 claims
- 1087US8174028B2Semiconductor composite apparatus, LED, LED printhead, and image forming apparatusOGIHARA MITSUHIKO·Filed 2010·Granted May 8, 2012·4 cites·12 claims
- 1186US8269229B2Layered semiconductor light emitting device and image forming apparatusSUZUKI TAKAHITO·Filed 2009·Granted Sep 18, 2012·15 cites·10 claims
- 1282US8183590B2Image display apparatus having raised parts disposed on a substrateSUZUKI TAKAHITO·Filed 2010·Granted May 22, 2012·7 cites·19 claims
- 1382US2024369145A1Valve deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1480US7947576B2Method of manufacturing by etching a semiconductor substrate horizontally without creating a vertical faceOKI DATA KK·Filed 2009·Granted May 24, 2011·8 cites·21 claims
- 1579US12078253B2Valve deviceDENSO CORP·Filed 2023·Granted Sep 3, 2024·0 cites·11 claims
- 1678US2025096217A1Method of manufacturing semiconductor composite deviceOKI ELECTRIC IND CO LTD·Filed 2024·Application pending·0 cites
- 1776US11788634B2Valve deviceDENSO CORP·Filed 2022·Granted Oct 17, 2023·0 cites·13 claims
- 1876US10648395B2Cooling-water control valve deviceDENSO CORP·Filed 2018·Granted May 12, 2020·3 cites·13 claims
- 1976US10009501B2Optical print head, image forming apparatus, and method of manufacturing the optical print headOKI DATA KK·Filed 2017·Granted Jun 26, 2018·2 cites·17 claims
- 2076US8384221B2Semiconductor device, LED head and method of manufacturing the sameOKI DATA KK·Filed 2009·Granted Feb 26, 2013·4 cites·14 claims
- 2176US7813748B2Group communications switching method, subscriber terminal and server used for the methodFUJITSU LTD·Filed 2006·Granted Oct 12, 2010·9 cites·7 claims
- 2275US9178115B2Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatusOKI DATA KK·Filed 2013·Granted Nov 3, 2015·4 cites·19 claims
- 2375US7078729B2Semiconductor device and method of manufacturing the sameOKI DATA KK·Filed 2004·Granted Jul 18, 2006·18 cites·13 claims
- 2470US8035116B2Semiconductor device, light emitting diode head, and image forming apparatusOKI DATA KK·Filed 2007·Granted Oct 11, 2011·4 cites·24 claims
- 2569US9574876B2Angle detectorDENSO CORP·Filed 2012·Granted Feb 21, 2017·2 cites·15 claims
- 2669US9214597B2Semiconductor deviceOKI DATA KK·Filed 2013·Granted Dec 15, 2015·2 cites·15 claims
- 2768US8481342B2Method of manufacturing semiconductor device, semiconductor device and semiconductor composite deviceOGIHARA MITSUHIKO·Filed 2010·Granted Jul 9, 2013·2 cites·4 claims
- 2868US7625809B2Semiconductor device and method of manufacturing the sameOKI DATA KK·Filed 2006·Granted Dec 1, 2009·2 cites·5 claims
- 2967US12191292B2Composite integrated film, composite integrated film supply wafer, and semiconductor composite deviceOKI ELECTRIC IND CO LTD·Filed 2021·Granted Jan 7, 2025·0 cites·19 claims
- 3067US9784383B2Actuator and assembling method thereofDENSO CORP·Filed 2015·Granted Oct 10, 2017·1 cites·12 claims
- 3167US7361935B2Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print headOKI DATA KK·Filed 2006·Granted Apr 22, 2008·3 cites·17 claims
- 3266US2025241046A1Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2025·Application pending·0 cites
- 3365US8022387B2Composite semiconductor device having a thyristor structureOKI DATA KK·Filed 2006·Granted Sep 20, 2011·3 cites·20 claims
- 3464US8743166B2Light-emitting device and method of manufacturing the sameOKI DATA KK·Filed 2013·Granted Jun 3, 2014·2 cites·8 claims
- 3562US8269314B2Display apparatusSUZUKI TAKAHITO·Filed 2008·Granted Sep 18, 2012·2 cites·8 claims
- 3660US12328928B2Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereofOKI ELECTRIC IND CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·11 claims
- 3759US8258537B2Efficient light emitting semiconductor deviceIGARI TOMOKI·Filed 2009·Granted Sep 4, 2012·2 cites·10 claims
- 3858US9463682B2Vehicle having air-conditioning function and display functionFUJI HEAVY IND LTD·Filed 2015·Granted Oct 11, 2016·1 cites·8 claims
- 3957US8664672B2Light emitting panel having a plurality of light emitting element arrays arranged in descending order of wavelengthOGIHARA MITSUHIKO·Filed 2008·Granted Mar 4, 2014·1 cites·17 claims
- 4057US2024332080A1Manufacturing method of substrate unit, and substrate unitOKI ELECTRIC IND CO LTD·Filed 2024·Application pending·0 cites
- 4157US2024332454A1Electronic structure, manufacturing method of electronic structure, and manufacturing method of electronic deviceOKI ELECTRIC IND CO LTD·Filed 2024·Application pending·0 cites
- 4256US11858755B2Gripping apparatus and stackerMURATA MACHINERY LTD·Filed 2020·Granted Jan 2, 2024·0 cites·8 claims
- 4356US8415680B2Semiconductor composite apparatus, print head, and image forming apparatusOGIHARA MITSUHIKO·Filed 2006·Granted Apr 9, 2013·1 cites·4 claims
- 4455US7456449B2Semiconductor apparatus, LED print head, and printerOKI DATA KK·Filed 2004·Granted Nov 25, 2008·7 cites·15 claims
- 4555US2024145620A1Manufacturing method of electronic deviceOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 4653US2023157055A1Electronic structure and method of manufacturing complex filmOKI ELECTRIC IND CO LTD·Filed 2022·Application pending·0 cites
- 4753US2023320217A1Piezoelectric-body film joint substrate and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 4853US2023320224A1Piezoelectric-body film joint substrate and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 4952US2024145239A1Manufacturing method of semiconductor element, semiconductor layer support structure, and semiconductor substrateOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
- 5052US2024145631A1Manufacturing method of semiconductor element, semiconductor layer support structure, and semiconductor substrateOKI ELECTRIC IND CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →