Inventor · disambiguated record
Takamichi Suzuki
Also filed as: SUZUKI TAKAMICHI
13 granted patents·510 citations·filing 1980–2002
94Inventor score
Files withHITACHI LTD13
Top patents by PatentIndex Score
13 records- 0192US6413850B1Method of forming bumpsHITACHI LTD·Filed 2000·Granted Jul 2, 2002·102 cites·12 claims
- 0287US4383359AParts feeding and assembling systemHITACHI LTD·Filed 1980·Granted May 17, 1983·48 cites·6 claims
- 0386US6460755B1Bump forming method and apparatus thereforHITACHI LTD·Filed 1997·Granted Oct 8, 2002·82 cites·7 claims
- 0485US5213176ASelf-propelled vehicleHITACHI LTD·Filed 1990·Granted May 25, 1993·121 cites·10 claims
- 0576US6869008B2Method of forming bumpsHITACHI LTD·Filed 2002·Granted Mar 22, 2005·24 cites·8 claims
- 0676US6595404B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2001·Granted Jul 22, 2003·18 cites·3 claims
- 0776US6213386B1Method of forming bumpsHITACHI LTD·Filed 1999·Granted Apr 10, 2001·40 cites·21 claims
- 0875US6695200B2Method of producing electronic part with bumps and method of producing electronic partHITACHI LTD·Filed 2002·Granted Feb 24, 2004·16 cites·12 claims
- 0973US6402014B1Method of forming bumpsHITACHI LTD·Filed 2000·Granted Jun 11, 2002·18 cites·3 claims
- 1072US4872618AApparatus for winding coil on toroidal coreHITACHI LTD·Filed 1988·Granted Oct 10, 1989·25 cites·19 claims
- 1147US6146920ABump formation methodHITACHI LTD·Filed 1998·Granted Nov 14, 2000·11 cites·11 claims
- 1245US6400020B1Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacersHITACHI LTD·Filed 2000·Granted Jun 4, 2002·1 cites·13 claims
- 1334US4771956AMethod of and apparatus for winding coil on toroidal coreHITACHI LTD·Filed 1986·Granted Sep 20, 1988·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →