Inventor · disambiguated record
Takuya Suzuki
Also filed as: SUZUKI TAKUYA
116 granted patents·34 pending applications·768 citations·filing 1973–2025
99Inventor score
Files withMITSUBISHI ELECTRIC CORP16FUNAI ELECTRIC CO11JTEKT CORP11MITSUBISHI GAS CHEMICAL CO11FUJI ELECTRIC CO LTD9
Top patents by PatentIndex Score
150 records- 0196US10876705B2Light emitting moduleNICHIA CORP·Filed 2020·Granted Dec 29, 2020·3 cites·13 claims
- 0294US9929417B2Valve deviceJTEKT CORP·Filed 2015·Granted Mar 27, 2018·6 cites·4 claims
- 0394US7336221B2High frequency package, transmitting and receiving module and wireless equipmentMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Feb 26, 2008·37 cites·27 claims
- 0493US12011775B2Steel joined body and method for manufacturing the sameNETUREN CO LTD·Filed 2022·Granted Jun 18, 2024·2 cites·10 claims
- 0593US10414653B2Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheetMITSUBISHI CHEM CORP·Filed 2018·Granted Sep 17, 2019·6 cites·12 claims
- 0692US11680139B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Jun 20, 2023·4 cites·2 claims
- 0791US3983521AFlexible superconducting composite compound wiresFURUKAWA ELECTRIC CO LTD·Filed 1973·Granted Sep 28, 1976·55 cites·9 claims
- 0890US8040286B2High frequency moduleMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Oct 18, 2011·25 cites·5 claims
- 0990US6876846B2High frequency moduleMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 5, 2005·54 cites·35 claims
- 1089US10428962B2Valve deviceJTEKT CORP·Filed 2017·Granted Oct 1, 2019·6 cites·9 claims
- 1189US8052119B2Valve deviceJTEKT CORP·Filed 2009·Granted Nov 8, 2011·20 cites·10 claims
- 1289US7504710B2Multilayer dielectric substrate and semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Mar 17, 2009·16 cites·7 claims
- 1389US4078299AMethod of manufacturing flexible superconducting composite compound wiresFURUKAWA ELECTRIC CO LTD·Filed 1976·Granted Mar 14, 1978·39 cites·23 claims
- 1488US6599782B1Semiconductor device and method of fabricating thereofSANYO ELECTRIC CO·Filed 2000·Granted Jul 29, 2003·52 cites·8 claims
- 1588US6255154B1Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2000·Granted Jul 3, 2001·43 cites·5 claims
- 1686US12246389B2Steel joined body and method for manufacturing the sameNETUREN CO LTD·Filed 2024·Granted Mar 11, 2025·0 cites·2 claims
- 1786US7847644B2Modulation signal generation circuit, transmission/reception module, and radar deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Dec 7, 2010·13 cites·13 claims
- 1886US2025379415A1Light emission moduleNICHIA CORP·Filed 2025·Application pending·0 cites
- 1985US10106413B2Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheetMITSUBISHI CHEM CORP·Filed 2016·Granted Oct 23, 2018·2 cites·12 claims
- 2085US8474792B2Valve device and manually operated shutoff valve deviceKUBO TOSHIKATSU·Filed 2008·Granted Jul 2, 2013·18 cites·5 claims
- 2184US12383974B2Steel joined body and method for manufacturing the sameNETUREN CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·5 claims
- 2284US10823718B2Gas alarm, control device and programOSAKA GAS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·14 claims
- 2384US8415140B2Analysis device, and analysis apparatus and method using the sameSAIKI HIROSHI·Filed 2008·Granted Apr 9, 2013·8 cites·6 claims
- 2483US11466123B2Resin composition, resin sheet, multilayer printed wiring board, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Oct 11, 2022·2 cites·7 claims
- 2583US10601147B2Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding objectSUMITOMO WIRING SYSTEMS·Filed 2017·Granted Mar 24, 2020·2 cites·7 claims
- 2683US8358185B2Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrateMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Jan 22, 2013·12 cites·10 claims
- 2782US11215221B1Ball joint assembly and method of assembly and ball joint compression ringMUSASHI AUTO PARTS CANADA INC·Filed 2020·Granted Jan 4, 2022·3 cites·15 claims
- 2882US2024402122A1Carbon dioxide gas sensorFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2981US8316877B2Component holding deviceNUMAZAKI KAZUSHI·Filed 2009·Granted Nov 27, 2012·7 cites·17 claims
- 3081US7994881B2Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguideMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Aug 9, 2011·7 cites·4 claims
- 3180US12306289B2Radar device, method of detecting failure of radar device, and method of operating radar deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Granted May 20, 2025·0 cites·11 claims
- 3280US8151819B2Fluid supply valve attachment deviceSUZUKI HIROAKI·Filed 2009·Granted Apr 10, 2012·11 cites·13 claims
- 3380US7164905B2High frequency moduleMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jan 16, 2007·8 cites·9 claims
- 3478US9910023B2Gas sensorFUJI ELECTRIC CO LTD·Filed 2016·Granted Mar 6, 2018·3 cites·18 claims
- 3578US9070961B2High-frequency circuit package and sensor moduleSUZUKI TAKUYA·Filed 2009·Granted Jun 30, 2015·6 cites·9 claims
- 3678US7498907B2Transmission line substrate and semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Mar 3, 2009·11 cites·21 claims
- 3777USD1037440SSyringeTAISEI KAKO CO·Filed 2022·Granted Jul 30, 2024·7 cites·1 claims
- 3877US7609592B2Reproduction apparatus and method capable of calculating error between designated time point and time stampFUNAI ELECTRIC CO·Filed 2005·Granted Oct 27, 2009·3 cites·12 claims
- 3975US9433080B2High-frequency circuit package and sensor moduleSUZUKI TAKUYA·Filed 2011·Granted Aug 30, 2016·3 cites·17 claims
- 4074US5495668AManufacturing method for a supermicro-connectorFURUKAWA ELECTRIC CO LTD·Filed 1994·Granted Mar 5, 1996·57 cites·30 claims
- 4173US9945803B2Gas detecting device and method thereofFUJI ELECTRIC CO LTD·Filed 2015·Granted Apr 17, 2018·1 cites·20 claims
- 4272US12099030B2Carbon dioxide gas sensorFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·3 claims
- 4371US10625767B2Steering deviceJTEKT CORP·Filed 2018·Granted Apr 21, 2020·2 cites·6 claims
- 4471US8028716B2Pressure-reducing valveJTEKT CORP·Filed 2005·Granted Oct 4, 2011·2 cites·2 claims
- 4571US7217998B2Semiconductor device having a heat-dissipation memberFUJITSU LTD·Filed 2004·Granted May 15, 2007·19 cites·34 claims
- 4669US12428070B2Body for vehicle, and battery electric vehicleTOYOTA MOTOR CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·8 claims
- 4769US7475327B2Optical disc recording and reproducing apparatusFUNAI ELECTRIC CO·Filed 2005·Granted Jan 6, 2009·2 cites·4 claims
- 4868US12424818B2Light emission moduleNICHIA CORP·Filed 2021·Granted Sep 23, 2025·0 cites·13 claims
- 4968US6713331B2Semiconductor device manufacturing using one element separation filmSANYO ELECTRIC CO·Filed 2001·Granted Mar 30, 2004·12 cites·6 claims
- 5068US5266416AAluminum-stabilized superconducting wireFURUKAWA ELECTRIC CO LTD·Filed 1992·Granted Nov 30, 1993·25 cites·14 claims
Showing the top 50 of 150 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →