Inventor · disambiguated record
Tatsuro Takagaki
Also filed as: TAKAGAKI TATSURO
20 granted patents·2 pending applications·13 citations·filing 2010–2023
89Inventor score
Top patents by PatentIndex Score
22 records- 0190US9538653B2Insulating substrates including through holesNGK INSULATORS LTD·Filed 2015·Granted Jan 3, 2017·4 cites·5 claims
- 0288US11658635B2Joined body of piezoelectric material substrate and support substrate, and acoustic wave elementNGK INSULATORS LTD·Filed 2020·Granted May 23, 2023·2 cites·5 claims
- 0385US9390955B2Handle substrate and composite wafer for semiconductor deviceNGK INSULATORS LTD·Filed 2015·Granted Jul 12, 2016·4 cites·8 claims
- 0476US12239022B2Assembly of piezoelectric material substrate and supporting substrateNGK INSULATORS LTD·Filed 2023·Granted Feb 25, 2025·0 cites·4 claims
- 0569US9046545B2Semiconductor device using a silicon wafer with a pattern arrangementTAKAGAKI TATSURO·Filed 2010·Granted Jun 2, 2015·3 cites·8 claims
- 0664US11871671B2Assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing sameNGK INSULATORS LTD·Filed 2020·Granted Jan 9, 2024·0 cites·5 claims
- 0756US11082025B2Joined body of piezoelectric material substrate and support substrateNGK INSULATORS LTD·Filed 2020·Granted Aug 3, 2021·0 cites·12 claims
- 0855US11082026B2Joined body of piezoelectric material substrate and support substrateNGK INSULATORS LTD·Filed 2020·Granted Aug 3, 2021·0 cites·8 claims
- 0955US9812345B2Composite substrate, semiconductor device, and method for manufacturing semiconductor deviceNGK INSULATORS LTD·Filed 2015·Granted Nov 7, 2017·0 cites·7 claims
- 1054US9894763B2Insulating substrates including through holesNGK INSULATORS LTD·Filed 2015·Granted Feb 13, 2018·0 cites·4 claims
- 1151US11689172B2Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assemblyNGK INSULATORS LTD·Filed 2020·Granted Jun 27, 2023·0 cites·6 claims
- 1251US2023200368A1Liquid spreaderROBUSTUS CO LTD·Filed 2020·Application pending·0 cites
- 1350US11700771B2Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assemblyNGK INSULATORS LTD·Filed 2020·Granted Jul 11, 2023·0 cites·3 claims
- 1447US9559090B2Silicon wafer with a plurality of chip patternsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Jan 31, 2017·0 cites·5 claims
- 1546US10257941B2Connection substrateNGK INSULATORS LTD·Filed 2018·Granted Apr 9, 2019·0 cites·4 claims
- 1645US11013127B2Method for producing connection substrateNGK INSULATORS LTD·Filed 2018·Granted May 18, 2021·0 cites·3 claims
- 1745US10278286B2Connection substrateNGK INSULATORS LTD·Filed 2018·Granted Apr 30, 2019·0 cites·3 claims
- 1845US9425083B2Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the sameNGK INSULATORS LTD·Filed 2015·Granted Aug 23, 2016·0 cites·7 claims
- 1942US10204838B2Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductorNGK INSULATORS LTD·Filed 2016·Granted Feb 12, 2019·0 cites·2 claims
- 2041US9673282B2Handle substrates of composite substrates for semiconductors, and composite substrates for semiconductorsNGK INSULATORS LTD·Filed 2015·Granted Jun 6, 2017·0 cites·2 claims
- 2138US9530954B2Piezoelectric elementNGK INSULATORS LTD·Filed 2013·Granted Dec 27, 2016·0 cites·16 claims
- 2235US2016046528A1Handle Substrates for Composite Substrates for SemiconductorsNGK INSULATORS LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →