Inventor · disambiguated record
Takaji Takenaka
Also filed as: TAKENAKA TAKAJI
10 granted patents·385 citations·filing 1984–1998
92Inventor score
Top patents by PatentIndex Score
10 records- 0193US4619316AHeat transfer apparatusHITACHI LTD·Filed 1985·Granted Oct 28, 1986·121 cites·4 claims
- 0284US6272020B1Structure for mounting a semiconductor device and a capacitor device on a substrateHITACHI LTD·Filed 1998·Granted Aug 7, 2001·82 cites·2 claims
- 0369US5257452AMethods of recovering a multi-layer printed circuit boardHITACHI LTD·Filed 1992·Granted Nov 2, 1993·31 cites·8 claims
- 0466US5291419AMethod for diagnosing the life of a solder connectionHITACHI LTD·Filed 1992·Granted Mar 1, 1994·32 cites·18 claims
- 0561US4706165AMultilayer circuit boardHITACHI MICROCUMPUTER ENG·Filed 1986·Granted Nov 10, 1987·30 cites·4 claims
- 0657US4930002AMulti-chip module structureHITACHI LTD·Filed 1988·Granted May 29, 1990·23 cites·4 claims
- 0753US4836434AMethod and apparatus for airtightly packaging semiconductor packageHITACHI LTD·Filed 1986·Granted Jun 6, 1989·18 cites·4 claims
- 0852US5249100AElectronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solderHITACHI LTD·Filed 1990·Granted Sep 28, 1993·22 cites·9 claims
- 0950US4725925ACircuit boardHITACHI LTD·Filed 1984·Granted Feb 16, 1988·12 cites·6 claims
- 1045US5136360AElectronic circuit device, method of connecting with solder and solder for connecting gold-plated terminalsHITACHI LTD·Filed 1990·Granted Aug 4, 1992·14 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →