Inventor · disambiguated record
Taizo Tomioka
Also filed as: TOMIOKA TAIZO
16 granted patents·13 pending applications·90 citations·filing 2003–2024
91Inventor score
Top patents by PatentIndex Score
29 records- 0197US10410976B2Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor deviceTOSHIBA KK·Filed 2016·Granted Sep 10, 2019·24 cites·9 claims
- 0293US11897050B1Method for joining dissimilar metals, joined body, and joining apparatusTOSHIBA KK·Filed 2022·Granted Feb 13, 2024·1 cites·16 claims
- 0384US10549379B2Friction stir welding method and joined bodyTOSHIBA KK·Filed 2017·Granted Feb 4, 2020·2 cites·13 claims
- 0479US10994367B2Friction stir welding equipmentTOSHIBA KK·Filed 2018·Granted May 4, 2021·1 cites·11 claims
- 0579USD521952SSemiconductor deviceTOSHIBA KK·Filed 2004·Granted May 30, 2006·26 cites·1 claims
- 0672US2025242430A1Welding method of membersTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0771USD508682SSemiconductor deviceTOSHIBA KK·Filed 2004·Granted Aug 23, 2005·18 cites·1 claims
- 0869US9460967B2Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor deviceTOSHIBA KK·Filed 2014·Granted Oct 4, 2016·2 cites·14 claims
- 0967US7683394B2Optical semiconductor device and method for manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 23, 2010·4 cites·2 claims
- 1066US7189962B2Semiconductor relay apparatus and wiring board fabrication methodTOSHIBA KK·Filed 2005·Granted Mar 13, 2007·2 cites·9 claims
- 1162US11331745B2Distance measuring device, friction stir welding apparatus, and friction stir welding methodTOSHIBA KK·Filed 2020·Granted May 17, 2022·0 cites·8 claims
- 1258US11502566B2Stator winding, generator, and connection method of stator winding conductorTOSHIBA KK·Filed 2020·Granted Nov 15, 2022·0 cites·8 claims
- 1356US7947999B2Luminescent device and method for manufacturing the sameTOSHIBA KK·Filed 2006·Granted May 24, 2011·2 cites·15 claims
- 1456US6861675B2Optically coupled semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Granted Mar 1, 2005·8 cites·9 claims
- 1552US2010075719A1Cellular phoneTOMIOKA TAIZO·Filed 2009·Application pending·0 cites
- 1651US2009147970A1Mobile terminal and sound input/output control method for mobile terminalTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1750US2019275607A1Friction stir welding tool, friction stir welding apparatus, and friction stir welding methodTOSHIBA KK·Filed 2019·Application pending·0 cites
- 1848US2009103260A1Portable electronic deviceTOMIOKA TAIZO·Filed 2008·Application pending·0 cites
- 1948US2015084473A1Induction motor and manufacturing method thereofTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2045US2020067389A1Coil structure and coil assembling methodTOSHIBA KK·Filed 2019·Application pending·0 cites
- 2145US2017361395A1Method for plugging orificeTOSHIBA KK·Filed 2017·Application pending·0 cites
- 2243US2008179751A1Manufacturing method of semiconductor devices and semiconductor device manufactured therebyTOSHIBA KK·Filed 2008·Application pending·0 cites
- 2342US2009197653A1Mobile apparatusTOSHIBA KK·Filed 2008·Application pending·0 cites
- 2441US2016059344A1Friction stir welding deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2540US7205239B2Method of manufacturing semiconductor wafer and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Apr 17, 2007·0 cites·9 claims
- 2640US2010195291A1Electronic circuit module and method of manufacturing the sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2738US7510911B2Semiconductor apparatus and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Mar 31, 2009·0 cites·9 claims
- 2835US9853279B2Battery and ultrasonic bonding method for batteryAIZAWA TAKAHIRO·Filed 2011·Granted Dec 26, 2017·0 cites·1 claims
- 2933US2016035657A1Semiconductor device and semiconductor moduleTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →