Inventor · disambiguated record
Tatsumi Tsuchiya
Also filed as: TSUCHIYA TATSUMI
39 granted patents·3 pending applications·460 citations·filing 1997–2018
98Inventor score
Files withHITACHI GLOBAL STORAGE TECH17IBM10HGST Netherlands BV3HITACHI GLOBAL STORAGE TECH NL3MATSUMOTO YUHSUKE3
Top patents by PatentIndex Score
42 records- 0195US6459549B1Hard disk drive with slider support structure and head gimbal assemblyIBM·Filed 2000·Granted Oct 1, 2002·84 cites·6 claims
- 0291US9558768B1Suspension standoff geometry for slider crown change reductionHGST Netherlands BV·Filed 2015·Granted Jan 31, 2017·13 cites·8 claims
- 0390US7554769B2Thin film magnetic head and head gimbal assemblyHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Jun 30, 2009·12 cites·20 claims
- 0490US6543677B2Solder-ball bonding device and methodIBM·Filed 2001·Granted Apr 8, 2003·51 cites·6 claims
- 0589US8593765B2Head gimbal assembly and disk drive with a piezoelectric elementUEMATSU YOSHIO·Filed 2010·Granted Nov 26, 2013·21 cites·17 claims
- 0688US7859793B2Magnetic head assembly that facilitates recovery of a magnetic head sliderHITACHI GLOBAL STORAGE TECH NL·Filed 2007·Granted Dec 28, 2010·9 cites·10 claims
- 0786US8427783B2Head-gimbal assembly, microactuator, and manufacturing method of the microactuatorTSUCHIYA TATSUMI·Filed 2009·Granted Apr 23, 2013·8 cites·4 claims
- 0882US7583475B2Rotating disk storage device and integrated wire head suspension assemblyHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Sep 1, 2009·7 cites·17 claims
- 0982US6742694B2Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatusHITACHI GLOBAL STORAGE TECH·Filed 2002·Granted Jun 1, 2004·32 cites·3 claims
- 1081US8881967B2Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assemblyMATSUMOTO YUHSUKE·Filed 2009·Granted Nov 11, 2014·8 cites·11 claims
- 1181US8837261B1Electrical contact for an energy-assisted magnetic recording laser sub-mountHGST Netherlands BV·Filed 2013·Granted Sep 16, 2014·5 cites·18 claims
- 1280US8477457B2Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridgeMATSUMOTO YUHSUKE·Filed 2011·Granted Jul 2, 2013·7 cites·22 claims
- 1379US6556384B1Head supporting arm, Data recording apparatus, with laser beam exposing aperture and limiterIBM·Filed 2000·Granted Apr 29, 2003·16 cites·5 claims
- 1478US6366431B1Head supporting arm having laser beam exposing apertureIBM·Filed 1999·Granted Apr 2, 2002·31 cites·23 claims
- 1577US6871392B2Method of constructing an integrated lead suspensionHITACHI GLOBAL STORAGE TECH·Filed 2002·Granted Mar 29, 2005·15 cites·1 claims
- 1676US7486480B2Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder massHITACHI GLOBAL STORAGE TECH·Filed 2006·Granted Feb 3, 2009·7 cites·17 claims
- 1775US7400470B2Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energyHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Jul 15, 2008·7 cites·18 claims
- 1874US7168154B2Method of constructing an integrated lead suspensionHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jan 30, 2007·12 cites·1 claims
- 1972US6879465B2Integrated lead suspension and method of constructionHITACHI GLOBAL STORAGE TECH·Filed 2003·Granted Apr 12, 2005·11 cites·10 claims
- 2071US7417827B2Head/slider supporting structure having lead wire inclined relative to slider padHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Aug 26, 2008·5 cites·5 claims
- 2170US10468057B2Flexure and actuator system for magnetic recording deviceWESTERN DIGITAL TECH INC·Filed 2018·Granted Nov 5, 2019·2 cites·21 claims
- 2270US6823581B2Apparatus for assembling a head gimbal assemblyHITACHI GLOBAL STORAGE TECH·Filed 2001·Granted Nov 30, 2004·6 cites·9 claims
- 2369US10029327B2Solder ball jet nozzle having improved reliabilityHGST Netherlands BV·Filed 2014·Granted Jul 24, 2018·1 cites·18 claims
- 2469US7984545B2Approaches for manufacturing a head gimbal assemblyHITACHI GLOBAL STORAGE TECH NL·Filed 2008·Granted Jul 26, 2011·6 cites·5 claims
- 2569US6628380B1Appearance inspecting jig for small parts and inspecting method employing the same jigIBM·Filed 2001·Granted Sep 30, 2003·9 cites·19 claims
- 2669US6382499B1Ultrasonic bonding performing method and method for transforming, retaining and releasing a suspension assemblyIBM·Filed 1998·Granted May 7, 2002·29 cites·5 claims
- 2766US8245749B2Method and apparatus for manufacturing a head-gimbal assemblyIMAI HIDETO·Filed 2009·Granted Aug 21, 2012·2 cites·4 claims
- 2866US7161766B2Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assemblyHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jan 9, 2007·4 cites·3 claims
- 2962US7893534B2Thermally insulating bonding pad structure for solder reflow connectionHITACHI GLOBAL STORAGE TECH NL·Filed 2007·Granted Feb 22, 2011·2 cites·20 claims
- 3060US6321974B1Method for ultrasonic bonding of slider and lead in a hard disk drive head gimbal assemblyIBM·Filed 2000·Granted Nov 27, 2001·8 cites·4 claims
- 3157US6989969B2Integrated lead suspension and method of constructionHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jan 24, 2006·4 cites·1 claims
- 3257US6985335B2Integrated lead suspension and method of constructionHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jan 10, 2006·4 cites·3 claims
- 3356US5754370AWired suspension assembly in disk storage device method for assembly head suspension assemblyIBM·Filed 1997·Granted May 19, 1998·12 cites·13 claims
- 3454US7137189B2Method of constructing an integrated lead suspensionHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Nov 21, 2006·3 cites·1 claims
- 3553US7380329B2Method of assembling a head gimbal assemblyHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jun 3, 2008·1 cites·2 claims
- 3652US7210221B2Transfer system for assembling a head gimbal assemblyHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted May 1, 2007·1 cites·11 claims
- 3752US6848167B2Apparatus and method for separating head gimbal assembly from bonding jigIBM·Filed 2001·Granted Feb 1, 2005·2 cites·6 claims
- 3850US7137188B2Method of constructing an integrated lead suspensionHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Nov 21, 2006·2 cites·8 claims
- 3943US6530613B2Air tweezer and sucking padIBM·Filed 2001·Granted Mar 11, 2003·1 cites·7 claims
- 4043US2008180856A1Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow jointHIRANO TOSHIKI·Filed 2007·Application pending·0 cites
- 4142US2013256281A1Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk driveTSUCHIYA TATSUMI·Filed 2012·Application pending·0 cites
- 4239US2011132879A1Connecting electrical partsMATSUMOTO YUHSUKE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →