Inventor · disambiguated record
Takehisa Tsujimura
Also filed as: TSUJIMURA TAKEHISA
5 granted patents·438 citations·filing 1986–1999
86Inventor score
Files withFUJITSU LTD5
Top patents by PatentIndex Score
5 records- 0197US5081067ACeramic package type semiconductor device and method of assembling the sameFUJITSU LTD·Filed 1991·Granted Jan 14, 1992·152 cites·22 claims
- 0289US5886408AMulti-chip semiconductor deviceFUJITSU LTD·Filed 1997·Granted Mar 23, 1999·126 cites·6 claims
- 0384US4682207ASemiconductor device including leadless packages and a base plate for mounting the leadless packagesFUJITSU LTD·Filed 1986·Granted Jul 21, 1987·72 cites·7 claims
- 0480US5055914ACeramic package type semiconductor device and method of assembling the sameFUJITSU LTD·Filed 1990·Granted Oct 8, 1991·37 cites·19 claims
- 0578US6143590AMulti-chip semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Nov 7, 2000·51 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →