Inventor · disambiguated record
Takayuki Uda
Also filed as: UDA TAKAYUKI
13 granted patents·346 citations·filing 1990–2003
93Inventor score
Files withHITACHI LTD13
Top patents by PatentIndex Score
13 records- 0191US6528878B1Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2000·Granted Mar 4, 2003·72 cites·11 claims
- 0281US6890799B2Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2003·Granted May 10, 2005·30 cites·10 claims
- 0380US5360988ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1992·Granted Nov 1, 1994·61 cites·14 claims
- 0478US5223454AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1991·Granted Jun 29, 1993·63 cites·11 claims
- 0567US5519658ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1994·Granted May 21, 1996·34 cites·29 claims
- 0666US7518233B1Sealing structure for multi-chip moduleHITACHI LTD·Filed 2000·Granted Apr 14, 2009·16 cites·4 claims
- 0765US6222278B1Input-output circuit cell and semiconductor integrated circuit apparatusHITACHI LTD·Filed 2000·Granted Apr 24, 2001·10 cites·2 claims
- 0859US6355984B2Input-output circuit cell and semiconductor integrated circuit apparatusHITACHI LTD·Filed 2001·Granted Mar 12, 2002·7 cites·7 claims
- 0957US5973406AElectronic device bonding method and electronic circuit apparatusHITACHI LTD·Filed 1997·Granted Oct 26, 1999·22 cites·6 claims
- 1044US5049972AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Sep 17, 1991·14 cites·16 claims
- 1143US7004760B2Connector and an electronic apparatus having electronic parts connected to each other by the connectorHITACHI LTD·Filed 2003·Granted Feb 28, 2006·5 cites·17 claims
- 1240US6281575B1Multi-chip moduleHITACHI LTD·Filed 1999·Granted Aug 28, 2001·9 cites·9 claims
- 1333US6121687AInput-output circuit cell and semiconductor integrated circuit apparatusHITACHI LTD·Filed 1997·Granted Sep 19, 2000·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →