Inventor · disambiguated record
Takumi Ueno
Also filed as: UENO TAKUMI
37 granted patents·2 pending applications·833 citations·filing 1982–2012
98Inventor score
Files withHITACHI LTD20RENESAS TECH CORP6MATSUTANI HIROSHI3HITACHI CHEM DUPONT MICROSYS2OOE MASAYUKI2
Top patents by PatentIndex Score
39 records- 0192US5328807AMethod of forming a patternHITICHI LTD·Filed 1991·Granted Jul 12, 1994·103 cites·16 claims
- 0291US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0388US4722881ARadiation-sensitive resist composition with an admixture of cis-(1,3,5,7-tetrahydroxy)-1,3,5,7-tetraphenylcyclotetrasiloxane and a polysilsesquioxaneHITACHI LTD·Filed 1985·Granted Feb 2, 1988·49 cites·8 claims
- 0487US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 0586US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 0686US6638352B2Thermal stable low elastic modulus material and device using the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·31 cites·6 claims
- 0781US6710263B2Semiconductor devicesRENESAS TECH CORP·Filed 2001·Granted Mar 23, 2004·33 cites·19 claims
- 0880US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 0978US8426985B2Positive-type photosensitive resin composition, method for producing resist pattern, and electronic componentMATSUTANI HIROSHI·Filed 2009·Granted Apr 23, 2013·9 cites·15 claims
- 1077US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 1177US6097100AResin sealed semiconductor devices and a process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 1, 2000·56 cites·16 claims
- 1276US6924971B2High dielectric constant composite material and multilayer wiring board using the sameHITACHI LTD·Filed 2002·Granted Aug 2, 2005·19 cites·2 claims
- 1376US6579623B2Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2002·Granted Jun 17, 2003·20 cites·16 claims
- 1475US5858584APositive photosensitive resin composition and electronic apparatus using the sameHITACHI LTD·Filed 1997·Granted Jan 12, 1999·29 cites·10 claims
- 1574US8097386B2Positive-type photosensitive resin composition, method for producing patterns, and electronic partsNAKANO HAJIME·Filed 2006·Granted Jan 17, 2012·6 cites·6 claims
- 1674US7851128B2Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentHITACHI CHEM DUPONT MICROSYS·Filed 2006·Granted Dec 14, 2010·3 cites·9 claims
- 1770US8461699B2Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic deviceMATSUTANI HIROSHI·Filed 2009·Granted Jun 11, 2013·3 cites·28 claims
- 1870US6396145B1Semiconductor device and method for manufacturing the same technical fieldHITACHI LTD·Filed 1998·Granted May 28, 2002·38 cites·26 claims
- 1970US4835089AResist pattern forming process with dry etchingHITACHI LTD·Filed 1987·Granted May 30, 1989·22 cites·34 claims
- 2068US5441849AMethod of forming pattern and making semiconductor device using radiation-induced conductive resin bottom resist layerHITACHI LTD·Filed 1993·Granted Aug 15, 1995·30 cites·22 claims
- 2165US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 2262US8304149B2Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentNUNOMURA MASATAKA·Filed 2010·Granted Nov 6, 2012·1 cites·16 claims
- 2361US7220481B2High dielectric constant composite material and multilayer wiring board using the sameHITACHI LTD·Filed 2002·Granted May 22, 2007·8 cites·7 claims
- 2461US4985344ARadiation imaging process for forming pattern without alkali-soluble polymer underlayer and water soluble radiation-sensitive diazonium salt overlayerHITACHI LTD·Filed 1989·Granted Jan 15, 1991·14 cites·20 claims
- 2561US4465768APattern-formation method with iodine containing azide and oxygen plasma etching of substrateHITACHI LTD·Filed 1982·Granted Aug 14, 1984·15 cites·19 claims
- 2659US5118582APattern forming material and process for forming pattern using the sameHITACHI LTD·Filed 1990·Granted Jun 2, 1992·19 cites·15 claims
- 2758US7150947B2Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentHITACHI CHEM DUPONT MICROSYS·Filed 2003·Granted Dec 19, 2006·12 cites·14 claims
- 2854US6888230B1Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 1999·Granted May 3, 2005·16 cites·20 claims
- 2953US9786576B2Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic deviceMATSUTANI HIROSHI·Filed 2008·Granted Oct 10, 2017·1 cites·11 claims
- 3052US8852726B2Photosensitive polymer composition, method of producing pattern and electronic partsOOE MASAYUKI·Filed 2012·Granted Oct 7, 2014·0 cites·10 claims
- 3151US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 3250US7217992B2Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 15, 2007·3 cites·12 claims
- 3346US6291619B1Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereofHITACHI CHEMICAL CO LTD·Filed 1998·Granted Sep 18, 2001·12 cites·7 claims
- 3442US6638631B2Thermal stable low elastic modulus material and device using the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·0 cites·6 claims
- 3540US2002158343A1Semiconductor device and wiring tape for semiconductor deviceFiled 2002·Application pending·0 cites
- 3639US2003201530A1Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2003·Application pending·0 cites
- 3738US8231959B2Photosensitive polymer composition, method of producing pattern and electronic partsOOE MASAYUKI·Filed 2004·Granted Jul 31, 2012·0 cites·12 claims
- 3836US8836089B2Positive photosensitive resin composition, method of creating resist pattern, and electronic componentTANIMOTO AKITOSHI·Filed 2011·Granted Sep 16, 2014·0 cites·22 claims
- 3928US5470996APattern forming material and process for forming pattern using the sameHITACHI LTD·Filed 1993·Granted Nov 28, 1995·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →