Inventor · disambiguated record
Tan Chong Un
Also filed as: UN TAN CHONG
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Top patents by PatentIndex Score
3 records- 0161US2025379186A1Semiconductor package having a semiconductor die layerSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0257US2024407180A1Single package data storage deviceWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0355US2024407100A1Electrolytic capacitors having enclosures that enable the capacitors to be surface mounted to a substrateWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →