Inventor · disambiguated record
Tamaki Wada
Also filed as: WADA TAMAKI
68 granted patents·20 pending applications·1,767 citations·filing 1993–2019
99Inventor score
Files withRENESAS TECH CORP36HITACHI LTD22RENESAS ELECTRONICS CORP9HITACHI ULSI SYS CO LTD7NISHIZAWA HIROTAKA4
Top patents by PatentIndex Score
88 records- 0198US7296754B2IC card moduleRENESAS TECH CORP·Filed 2005·Granted Nov 20, 2007·106 cites·38 claims
- 0298US6555918B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2002·Granted Apr 29, 2003·188 cites·9 claims
- 0397US7291903B2Memory cardRENESAS TECH CORP·Filed 2005·Granted Nov 6, 2007·44 cites·27 claims
- 0495USD552098SMemory cardSONY KABUSHIKI KAISHA·Filed 2005·Granted Oct 2, 2007·70 cites·1 claims
- 0595USD552099SMemory cardSONY KABUSHIKI KAISHA·Filed 2005·Granted Oct 2, 2007·73 cites·1 claims
- 0695US7233058B2Memory card with an adaptorRENESAS TECH CORP·Filed 2005·Granted Jun 19, 2007·25 cites·60 claims
- 0793US7352588B2Semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 1, 2008·26 cites·14 claims
- 0893US7294918B2Memory card with connecting portions for connection to an adapterRENESAS TECH CORP·Filed 2006·Granted Nov 13, 2007·19 cites·35 claims
- 0992US7669773B2IC card moduleRENESAS TECH CORP·Filed 2007·Granted Mar 2, 2010·22 cites·21 claims
- 1092US7053471B2Memory cardHITACHI ULSI SYS CO LTD·Filed 2002·Granted May 30, 2006·44 cites·49 claims
- 1192US6853089B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 8, 2005·83 cites·29 claims
- 1292US6492727B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 10, 2002·55 cites·7 claims
- 1392US6252299B1Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 1998·Granted Jun 26, 2001·98 cites·7 claims
- 1490USD581932SMemory cardRENESAS TECH CORP·Filed 2007·Granted Dec 2, 2008·38 cites·1 claims
- 1589US7981788B2Semiconductor device and a manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2006·Granted Jul 19, 2011·20 cites·19 claims
- 1689USD556764SMemory cardRENESAS TECH CORP·Filed 2007·Granted Dec 4, 2007·34 cites·1 claims
- 1789US6858925B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Feb 22, 2005·35 cites·4 claims
- 1888USD504433SMemory cardRENESAS TECH CORP·Filed 2004·Granted Apr 26, 2005·35 cites·1 claims
- 1987US6433421B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Aug 13, 2002·64 cites·5 claims
- 2085US7341198B2IC card and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Mar 11, 2008·41 cites·17 claims
- 2185US7325746B2Memory card and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 5, 2008·35 cites·7 claims
- 2284US6169325B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 2, 2001·82 cites·12 claims
- 2383US7946500B2Memory card and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted May 24, 2011·10 cites·8 claims
- 2483US7322531B2Electronic device and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2006·Granted Jan 29, 2008·11 cites·25 claims
- 2583US6531773B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Mar 11, 2003·26 cites·41 claims
- 2683US6410987B1Semiconductor device and a method of manufacturing the same and an electronic deviceHITACHI LTD·Filed 1999·Granted Jun 25, 2002·65 cites·12 claims
- 2781US7467464B2Method of manufacturing a memory cardRENESAS TECH CORP·Filed 2007·Granted Dec 23, 2008·9 cites·8 claims
- 2880US6383845B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2001·Granted May 7, 2002·20 cites·8 claims
- 2979US7239011B2Memory card with a cap having indented portionsRENESAS TECH CORP·Filed 2005·Granted Jul 3, 2007·5 cites·63 claims
- 3078US6750080B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·24 cites·9 claims
- 3177US7971793B2Memory cardRENESAS ELECTRONICS CORP·Filed 2007·Granted Jul 5, 2011·6 cites·12 claims
- 3277US7120029B2IC card and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Oct 10, 2006·21 cites·26 claims
- 3377US5895969AThin type semiconductor device, module structure using the device and method of mounting the device on boardHITACHI LTD AND HITACHI VLSI E·Filed 1997·Granted Apr 20, 1999·45 cites·36 claims
- 3476US7227251B2Semiconductor device and a memory system including a plurality of IC chips in a common packageELPIDA MEMORY INC·Filed 2005·Granted Jun 5, 2007·6 cites·10 claims
- 3573US7271475B2Memory card with connecting portions for connection to an adapterRENESAS TECH CORP·Filed 2006·Granted Sep 18, 2007·3 cites·34 claims
- 3673US6501173B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 31, 2002·14 cites·13 claims
- 3772US5723903AThin type semiconductor device, module structure using the device and method of mounting the device on boardHITACHI LTD·Filed 1995·Granted Mar 3, 1998·35 cites·18 claims
- 3871US7971791B2Multi-function card deviceRENESAS ELECTRONICS CORP·Filed 2003·Granted Jul 5, 2011·15 cites·8 claims
- 3971US7308588B2Memory cardRENESAS TECH CORP·Filed 2004·Granted Dec 11, 2007·15 cites·13 claims
- 4068US7543757B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Jun 9, 2009·3 cites·6 claims
- 4166US7656014B2Semiconductor device and method for manufacturing sameRENESAS TECH CORP·Filed 2007·Granted Feb 2, 2010·3 cites·14 claims
- 4266US7360713B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Apr 22, 2008·9 cites·9 claims
- 4364US9583455B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 28, 2017·1 cites·8 claims
- 4464US6501183B2Semiconductor device and a method of manufacturing the same and an electronic deviceHITACHI LTD·Filed 2001·Granted Dec 31, 2002·11 cites·8 claims
- 4563USD552612SMemory cardRENESAS TECH CORP·Filed 2005·Granted Oct 9, 2007·13 cites·1 claims
- 4663US5446313AThin type semiconductor device and module structure using the deviceHITACHI LTD·Filed 1993·Granted Aug 29, 1995·25 cites·9 claims
- 4762US9337134B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted May 10, 2016·1 cites·20 claims
- 4862US6885092B1Semiconductor device and a memory system including a plurality of IC chips in a common packageHITACHI ULSI SYS CO LTD·Filed 1999·Granted Apr 26, 2005·24 cites·4 claims
- 4960US6297545B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·7 cites·8 claims
- 5060US6153922ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 28, 2000·19 cites·13 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →