Inventor · disambiguated record
Takayuki Waseda
Also filed as: WASEDA TAKAYUKI
18 granted patents·15 pending applications·146 citations·filing 1993–2025
91Inventor score
Top patents by PatentIndex Score
33 records- 0196US11417518B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0293US11935742B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·1 cites·21 claims
- 0390US11626280B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 11, 2023·1 cites·19 claims
- 0488US6019463AInk cartridgeCITIZEN WATCH CO LTD·Filed 1997·Granted Feb 1, 2000·78 cites·15 claims
- 0586US12400874B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·23 claims
- 0686US11923191B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 0785US12283478B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 22, 2025·0 cites·21 claims
- 0885US5453771AInk tankCITIZEN WATCH CO LTD·Filed 1993·Granted Sep 26, 1995·60 cites·2 claims
- 0985US2025285878A1Apparatus for etching baseKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1083US2025336670A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1182US12278103B2Method of processing substrate and method of manufacturing semiconductor device by forming filmKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 15, 2025·0 cites·22 claims
- 1281US12374544B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1381US2025226204A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1480US11335554B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 17, 2022·1 cites·18 claims
- 1580US2025391678A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1678US11894239B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 6, 2024·0 cites·21 claims
- 1775US2025246427A1Processing apparatus, processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1873US11315800B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 1972US12033852B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 2071US12424463B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 2171US11848203B2Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 19, 2023·0 cites·24 claims
- 2270US2025218764A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2366US12283476B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 22, 2025·0 cites·22 claims
- 2459US2025112063A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2556US2024112907A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2656US2024030026A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2756US2025372368A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2854US2024096617A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2950US2025305143A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3049US2022005685A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3147US2021305043A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3236US7138473B2Small portable instrumentCITIZEN WATCH CO LTD·Filed 2001·Granted Nov 21, 2006·0 cites·22 claims
- 3336US2013094333A1Timepiece display plateITO NOBUO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →