Inventor · disambiguated record
Tao Wu
Also filed as: WU TAO · WU TAO-CHENG
28 granted patents·6 pending applications·190 citations·filing 2009–2024
95Inventor score
Top patents by PatentIndex Score
34 records- 0198US10440668B1Vehicle platooning management and power control with LTE/5G V2X communicationsFORD GLOBAL TECH LLC·Filed 2018·Granted Oct 8, 2019·30 cites·18 claims
- 0296US11206513B1Vehicle density over the air update schedulingFORD GLOBAL TECH LLC·Filed 2020·Granted Dec 21, 2021·7 cites·19 claims
- 0393US9704735B2Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabricationKONCHADY MANOHAR S·Filed 2014·Granted Jul 11, 2017·21 cites·25 claims
- 0493US8643184B1Crosstalk polarity reversal and cancellation through substrate material tuningZHANG ZHICHAO·Filed 2012·Granted Feb 4, 2014·19 cites·13 claims
- 0591US9488483B2Localization using road markingsHONDA MOTOR CO LTD·Filed 2013·Granted Nov 8, 2016·21 cites·19 claims
- 0691US8127979B1Electrolytic depositon and via filling in coreless substrate processingWU TAO·Filed 2010·Granted Mar 6, 2012·32 cites·20 claims
- 0789US9806011B2Non-uniform substrate stackupINTEL CORP·Filed 2015·Granted Oct 31, 2017·7 cites·11 claims
- 0889US8461036B2Multiple surface finishes for microelectronic package substratesWU TAO·Filed 2009·Granted Jun 11, 2013·26 cites·20 claims
- 0987US10629469B2Solder resist layers for coreless packages and methods of fabricationINTEL CORP·Filed 2017·Granted Apr 21, 2020·4 cites·4 claims
- 1080US11443970B2Methods of forming a package substrateINTEL CORP·Filed 2020·Granted Sep 13, 2022·1 cites·7 claims
- 1179US10433421B2Reduced capacitance land padINTEL CORP·Filed 2012·Granted Oct 1, 2019·3 cites·11 claims
- 1278US9053372B2Road marking detection and recognitionRANGANATHAN ANANTH·Filed 2012·Granted Jun 9, 2015·5 cites·23 claims
- 1374US8615093B2Apparatus and method for processing audio signalHUNG TIEN-CHIU·Filed 2009·Granted Dec 24, 2013·8 cites·18 claims
- 1471US10923943B2Battery powered device with pre-powered circuitSTL TECHNOLOGY CO LTD·Filed 2018·Granted Feb 16, 2021·2 cites·5 claims
- 1568US9232639B2Non-uniform substrate stackupINTEL CORP·Filed 2012·Granted Jan 5, 2016·2 cites·16 claims
- 1664US11516915B2Reduced capacitance land padINTEL CORP·Filed 2019·Granted Nov 29, 2022·0 cites·19 claims
- 1760US9299602B2Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) packageZHANG QINGLEI·Filed 2011·Granted Mar 29, 2016·2 cites·25 claims
- 1858US2024359560A1Battery management system for an electric vehicleJOULES MILES CO LTD·Filed 2023·Application pending·0 cites
- 1957US9093313B2Device packaging with substrates having embedded lines and metal defined padsINTEL CORP·Filed 2014·Granted Jul 28, 2015·0 cites·3 claims
- 2056US9331017B2Chip package incorporating interfacial adhesion through conductor sputteringINTEL CORP·Filed 2014·Granted May 3, 2016·0 cites·10 claims
- 2155US9391018B2Crosstalk polarity reversal and cancellation through substrate material tuningINTEL CORP·Filed 2014·Granted Jul 12, 2016·0 cites·15 claims
- 2254US11217866B2Battery module for improving safetySTL TECHNOLOGY CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·8 claims
- 2353US11576256B2Printed circuit board for gallium nitride elementsDELTA ELECTRONICS SHANGHAI CO·Filed 2021·Granted Feb 7, 2023·0 cites·12 claims
- 2453US9564407B2Crosstalk polarity reversal and cancellation through substrate materialINTEL CORP·Filed 2016·Granted Feb 7, 2017·0 cites·5 claims
- 2553US9355952B2Device packaging with substrates having embedded lines and metal defined padsINTEL CORP·Filed 2015·Granted May 31, 2016·0 cites·14 claims
- 2651US8871634B2Chip package incorporating interfacial adhesion through conductor sputteringWU TAO·Filed 2012·Granted Oct 28, 2014·0 cites·16 claims
- 2748US2024380287A1lithium battery motor and its transportation mode plugCHANGZHOU YOOKSMART INNOVATION CO LTD·Filed 2024·Application pending·0 cites
- 2846US2023399846A1Wall of a buildingJOULES MILES CO LTD·Filed 2022·Application pending·0 cites
- 2944US2014004361A1Substrate cores for laser through hole formationSHARMA NIKHIL·Filed 2012·Application pending·0 cites
- 3043US8835217B2Device packaging with substrates having embedded lines and metal defined padsHLAD MARK S·Filed 2010·Granted Sep 16, 2014·0 cites·5 claims
- 3143US2020052772A1Data transmission method and network deviceHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
- 3237US9607937B2Pin grid interposerWATTS NICHOLAS R·Filed 2011·Granted Mar 28, 2017·0 cites·22 claims
- 3335US2012077054A1Electrolytic gold or gold palladium surface finish application in coreless substrate processingWU TAO·Filed 2010·Application pending·0 cites
- 3434US9461679B2System, method, and apparatus for analog signal conditioning of high-speed data streamsBROADCOM CORP·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →