Inventor · disambiguated record
Takao Yamazaki
Also filed as: ONUMA MINORU · YAMAZAKI TAKAO
51 granted patents·14 pending applications·917 citations·filing 1978–2017
98Inventor score
Top patents by PatentIndex Score
65 records- 0194US6998704B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2003·Granted Feb 14, 2006·86 cites·56 claims
- 0294US6524905B2Semiconductor device, and thin film capacitorNEC CORP·Filed 2001·Granted Feb 25, 2003·76 cites·7 claims
- 0390US6515324B2Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing sameNEC CORP·Filed 2001·Granted Feb 4, 2003·59 cites·22 claims
- 0490US6458883B1Conductive rubber composition and manufacturing method and conductive rubber member thereofJSR CORP·Filed 2000·Granted Oct 1, 2002·46 cites·18 claims
- 0587US6931061B2Method of real time MPEG-4 texture decoding for a multiprocessor environmentSONY ELECTRONICS INC·Filed 2002·Granted Aug 16, 2005·28 cites·45 claims
- 0685US8525323B2Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2009·Granted Sep 3, 2013·12 cites·21 claims
- 0785US8411450B2Electronic device package, module, and electronic deviceYAMAZAKI TAKAO·Filed 2007·Granted Apr 2, 2013·14 cites·26 claims
- 0885US4751663AIIR digital filterSONY CORP·Filed 1984·Granted Jun 14, 1988·28 cites·3 claims
- 0985US4677499ADigital time base correctorSONY CORP·Filed 1985·Granted Jun 30, 1987·33 cites·5 claims
- 1084US6703705B2Semiconductor device and method for packaging sameNEC CORP·Filed 2001·Granted Mar 9, 2004·31 cites·19 claims
- 1182US7504701B2Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheetNEC ELECTRONICS CORP·Filed 2007·Granted Mar 17, 2009·9 cites·20 claims
- 1282US7136541B2Method of performing sub-pixel based edge-directed image interpolationSONY ELECTRONICS INC·Filed 2002·Granted Nov 14, 2006·31 cites·28 claims
- 1381US8338940B2Semiconductor deviceYAMAZAKI TAKAO·Filed 2009·Granted Dec 25, 2012·12 cites·26 claims
- 1477US8956915B2Method of manufacturing a three-dimensional packaging semiconductor deviceNEC CORP·Filed 2012·Granted Feb 17, 2015·4 cites·2 claims
- 1576US7795585B2Vacuum package and manufacturing process thereofNEC CORP·Filed 2008·Granted Sep 14, 2010·7 cites·10 claims
- 1676US5145255AStirring apparatus and stirring tower type apparatus for polmerization reactionsMITSUBISHI JUKOGOYO KABUSHIKI·Filed 1990·Granted Sep 8, 1992·46 cites·7 claims
- 1775US7812440B2Electronic package device, module, and electronic apparatusNEC CORP·Filed 2007·Granted Oct 12, 2010·9 cites·19 claims
- 1875US7724820B2Method of real time MPEG-4 texture decoding for a multiprocessor environmentSONY CORP·Filed 2005·Granted May 25, 2010·3 cites·30 claims
- 1975US7230328B2Semiconductor package and laminated semiconductor packageNEC CORP·Filed 2003·Granted Jun 12, 2007·22 cites·9 claims
- 2075US5666169AParallel processor apparatus having means for processing signals of different lengthsSONY CORP·Filed 1995·Granted Sep 9, 1997·45 cites·8 claims
- 2174US9157805B2Infrared ray sensor package, infrared ray sensor module, and electronic deviceNEC CORP·Filed 2013·Granted Oct 13, 2015·3 cites·17 claims
- 2273US8785853B2Infrared sensor package and electronic device equipped therewithYAMAZAKI TAKAO·Filed 2011·Granted Jul 22, 2014·3 cites·6 claims
- 2371US4862403ADigital filterSONY CORP·Filed 1985·Granted Aug 29, 1989·19 cites·2 claims
- 2470US5550801ALinear arrayed disc changer with shiftable guide projectionsPIONEER ELECTRONIC CORP·Filed 1995·Granted Aug 27, 1996·27 cites·4 claims
- 2570US4189724AElectric restriction indicator with a contactless switch device for indicating a restriction in filter elementsDONALDSON CO INC·Filed 1978·Granted Feb 19, 1980·25 cites·15 claims
- 2668US7426462B2Fast codebook selection method in audio encodingSONY CORP·Filed 2003·Granted Sep 16, 2008·21 cites·22 claims
- 2766US5389923ASampling rate converterSONY CORP·Filed 1993·Granted Feb 14, 1995·26 cites·6 claims
- 2865US8130503B2Mounting structure of semiconductor device and electronic apparatus using thereofWATANABE SHINJI·Filed 2009·Granted Mar 6, 2012·2 cites·19 claims
- 2964US4705580ACutting method to be applied to producing helical springs by cold-forming thick high-strength wireNETUREN CO LTD·Filed 1986·Granted Nov 10, 1987·20 cites·3 claims
- 3063US5864706ADigital signal processing apparatus and information processing systemSONY CORP·Filed 1996·Granted Jan 26, 1999·43 cites·57 claims
- 3160US4222799AHigh-strength spring steel and its manufacturing processNETUREN CO LTD·Filed 1978·Granted Sep 16, 1980·11 cites·4 claims
- 3259US8093706B2Mounting structure of semiconductor device and electronic apparatus using sameWATANABE SHINJI·Filed 2009·Granted Jan 10, 2012·1 cites·23 claims
- 3358US4706211ADigital multiplying circuitSONY CORP·Filed 1984·Granted Nov 10, 1987·22 cites·7 claims
- 3457US11143257B2Steel wire for springSUMITOMO SEI STEEL WIRE CORP·Filed 2017·Granted Oct 12, 2021·0 cites·5 claims
- 3555US7928556B2Semiconductor device and manufacturing method thereofNEC CORP·Filed 2008·Granted Apr 19, 2011·0 cites·12 claims
- 3655US6486540B2Three-dimensional semiconductor device and method of manufacturing the sameNEC CORP·Filed 2001·Granted Nov 26, 2002·6 cites·28 claims
- 3753US6949815B2Semiconductor device with decoupling capacitors mounted on conductorsNEC CORP·Filed 2003·Granted Sep 27, 2005·4 cites·3 claims
- 3851US8236616B2Semiconductor device and manufacturing method thereofYAMAZAKI TAKAO·Filed 2011·Granted Aug 7, 2012·0 cites·11 claims
- 3951US8093709B2Semiconductor device and manufacturing method thereofYAMAZAKI TAKAO·Filed 2011·Granted Jan 10, 2012·0 cites·12 claims
- 4050US2014022718A1Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 4150US2013234295A1Semiconductor device and method of manufacturing same, wiring board and method of manufacturing same, semiconductor package, and electronic deviceNEC CORP·Filed 2013·Application pending·0 cites
- 4249US7594644B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2005·Granted Sep 29, 2009·0 cites·19 claims
- 4349US2013291380A1Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 4446US8120921B2Device having electronic components mounted therein and method for manufacturing such deviceYAMAZAKI TAKAO·Filed 2008·Granted Feb 21, 2012·0 cites·15 claims
- 4546US6038350ASignal processing apparatusSONY CORP·Filed 1999·Granted Mar 14, 2000·15 cites·13 claims
- 4646US6035686AMethod and installation for producing biconical wireMUHR & BENDER·Filed 1998·Granted Mar 14, 2000·8 cites·27 claims
- 4746US2007199011A1System and method for high quality AVC encodingSONY ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 4846US2011304029A1Semiconductor device and manufacturing method thereof, wiring board and manufacturing method thereof, semiconductor package, and electronic apparatusSOGAWA YOSHIMICHI·Filed 2011·Application pending·0 cites
- 4945US2008001288A1Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic ApparatusSOGAWA YOSHIMICHI·Filed 2005·Application pending·0 cites
- 5045US2008224271A1Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic DeviceNEC CORP·Filed 2005·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →