Inventor · disambiguated record
Tay Wuu Yean
Also filed as: YEAN TAY WUU
13 granted patents·1,172 citations·filing 2001–2011
95Inventor score
Top patents by PatentIndex Score
13 records- 0198US7573136B2Semiconductor device assemblies and packages including multiple semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·128 cites·9 claims
- 0298US7198980B2Methods for assembling multiple semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 3, 2007·230 cites·22 claims
- 0398US6906415B2Semiconductor device assemblies and packages including multiple semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·203 cites·55 claims
- 0495US7145228B2Microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 5, 2006·104 cites·21 claims
- 0595US6946325B2Methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 20, 2005·344 cites·46 claims
- 0694US6913476B2Temporary, conformable contacts for microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 5, 2005·75 cites·64 claims
- 0788US8072082B2Pre-encapsulated cavity interposerYEAN TAY WUU·Filed 2008·Granted Dec 6, 2011·28 cites·32 claims
- 0887US7947529B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted May 24, 2011·13 cites·21 claims
- 0981US6773960B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 10, 2004·21 cites·26 claims
- 1073US8399297B2Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packagesYEAN TAY WUU·Filed 2011·Granted Mar 19, 2013·4 cites·17 claims
- 1171US7112876B2Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriersMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·3 cites·18 claims
- 1271US6870247B2Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembledMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 22, 2005·12 cites·18 claims
- 1363US6951777B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 4, 2005·7 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →