Inventor · disambiguated record
Tadahiko Yokota
Also filed as: YOKOTA TADAHIKO
27 granted patents·4 pending applications·673 citations·filing 1987–2013
97Inventor score
Top patents by PatentIndex Score
31 records- 0197US6403221B1Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the sameAJINOMOTO KK·Filed 2000·Granted Jun 11, 2002·133 cites·56 claims
- 0296US5430112AEpoxy resin and polythiol compositionAJINOMOTO KK·Filed 1993·Granted Jul 4, 1995·127 cites·15 claims
- 0391US6739040B1Method of manufacturing multilayered printed wiring board using adhesive filmAJINOMOTO KK·Filed 2000·Granted May 25, 2004·55 cites·21 claims
- 0490US6805958B2Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the sameAJINOMOTO KK·Filed 2002·Granted Oct 19, 2004·52 cites·52 claims
- 0587US6376053B1Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the sameAJINOMOTO KK·Filed 2000·Granted Apr 23, 2002·30 cites·18 claims
- 0686US8382996B2Metal-clad laminateAJINOMOTO KK·Filed 2010·Granted Feb 26, 2013·8 cites·32 claims
- 0785US5439977AAcid anhydride-containing one package of epoxy resin compositionAJINOMOTO KK·Filed 1994·Granted Aug 8, 1995·36 cites·9 claims
- 0880US8357443B2Laminate including water soluble release layer for producing circuit board and method of producing circuit boardAJINOMOTO KK·Filed 2009·Granted Jan 22, 2013·4 cites·18 claims
- 0978US8584352B2Process for producing multilayer printed wiring boardNARAHASHI HIROHISA·Filed 2010·Granted Nov 19, 2013·8 cites·56 claims
- 1078US6124023APrepreg for laminate and process for producing printed wiring-board using the sameAJINOMOTO KK·Filed 1997·Granted Sep 26, 2000·42 cites·11 claims
- 1175US9516765B2Method for producing printed wiring boardAJINOMOTO KK·Filed 2013·Granted Dec 6, 2016·4 cites·10 claims
- 1273US7208062B2Method of producing multilayer printed wiring boardAJINOMOTO KK·Filed 2004·Granted Apr 24, 2007·17 cites·33 claims
- 1373US6380343B1Curable resin composition for overcoat of flexible circuitAJINOMOTO KK·Filed 2000·Granted Apr 30, 2002·9 cites·12 claims
- 1466US6133377ACompostion of epoxy resin, phenol-triazine-aldehyde condensate and rubberAJINOMOTO KK·Filed 1998·Granted Oct 17, 2000·26 cites·13 claims
- 1565US6881293B2Process for producing a multi-layer printer wiring boardAJINOMOTO KK·Filed 2002·Granted Apr 19, 2005·15 cites·35 claims
- 1663US7037586B2Film for circuit boardAJINOMOTO KK·Filed 2004·Granted May 2, 2006·9 cites·22 claims
- 1763US6818702B1Thermosetting resin composition and flexible circuit overcoating material comprising the sameAJINOMOTO KK·Filed 2000·Granted Nov 16, 2004·11 cites·12 claims
- 1863US6335417B1Modified polyimide resin and thermosetting resin composition containing the sameAJINOMOTO KK·Filed 1999·Granted Jan 1, 2002·29 cites·14 claims
- 1962US5723262AResin compositionAJINOMOTO KK·Filed 1996·Granted Mar 3, 1998·17 cites·6 claims
- 2062US4892676APhenyl pyrimidine compound and liquid crystalline compositionAJINOMOTO KK·Filed 1987·Granted Jan 9, 1990·6 cites·11 claims
- 2156US2005178501A1Process for producing a multi-layer printer wiring boardAJINOMOTO KK·Filed 2005·Application pending·0 cites
- 2254US6162889ACurable resin composition for overcoat of flexible circuitAJINOMOTO KK·Filed 1998·Granted Dec 19, 2000·15 cites·12 claims
- 2352US6376609B2Photosensitive resin and photosensitive resin composition containing the sameAJINOMOTO KK·Filed 2001·Granted Apr 23, 2002·1 cites·5 claims
- 2450US2010040874A1Film for metal film transfer, method for transferring metal film and method for manufacturing circuit boardAJINOMOTO KK·Filed 2009·Application pending·0 cites
- 2549US8337655B2Process for producing multilayer printed wiring boardNAKAMURA SHIGEO·Filed 2010·Granted Dec 25, 2012·0 cites·13 claims
- 2648US8992713B2Process for producing multilayer printed wiring boardNAKAMURA SHIGEO·Filed 2012·Granted Mar 31, 2015·0 cites·18 claims
- 2744US5403511AFerroelectric liquid crystal composition and ferroelectric liquid crystal display deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Apr 4, 1995·7 cites·3 claims
- 2844US4874542APhenyl-pyrimidine liquid crystal compounds and liquid crystal compositions containing the sameAJINOMOTO KK·Filed 1988·Granted Oct 17, 1989·7 cites·15 claims
- 2943US2007088134A1Thermosetting resin composition containing modified polyimide resinAJINOMOTO KK·Filed 2005·Application pending·0 cites
- 3038US6221972B1Photosensitive resin and photosensitive resin composition containing the sameAJINOMOTO KK·Filed 1997·Granted Apr 24, 2001·5 cites·6 claims
- 3138US2004099367A1Adhesive film and method for manufacturing multilayer printed wiring board comprising the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →