Inventor · disambiguated record
Taewon Yoo
Also filed as: YOO TAEWON
11 granted patents·4 pending applications·15 citations·filing 2019–2025
84Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0193US11164805B2Semiconductor package including non-conductive film between package substrate and semiconductor chip thereonSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·4 cites·20 claims
- 0292US12327824B2Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0392US12191236B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 7, 2025·2 cites·20 claims
- 0486US11362054B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·19 claims
- 0583US11296004B2Semiconductor package including heat redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 5, 2022·4 cites·12 claims
- 0678US11705418B2Semiconductor package with conductive bump on conductive post including an intermetallic compound layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·1 cites·20 claims
- 0774US2025105100A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0870US2025259975A1Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0966US12009328B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 1066US11676875B2Semiconductor package including non-conductive film between package substrate and semiconductor chip thereonSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1157US12362253B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1252US2023101149A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1351US11430772B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 1448US12154889B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1544US2021167007A1Redistribution structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →